Inventor · disambiguated record

Jian Bin Gu

Also filed as: GU JIAN BIN

1 granted patent·5 citations·filing 2018–2018

26Inventor score

Technology areasH10P

Files withSANDISK SEMICONDUCTOR SHANGHAI CO LTD1

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1 record

0181US10483239B2Semiconductor device including dual pad wire bond interconnectionSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2018·Granted Nov 19, 2019·5 cites·22 claims

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