Inventor · disambiguated record
Sanha Kim
Also filed as: KIM SANHA
8 granted patents·5 pending applications·9 citations·filing 2015–2025
77Inventor score
Files withMASSACHUSETTS INST TECHNOLOGY6KOREA ADVANCED INST SCI & TECH4KPX CHEMICAL CO LTD2SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
13 records- 0188US10583677B2Nanoporous stamp printing of nanoparticulate inksMASSACHUSETTS INST TECHNOLOGY·Filed 2017·Granted Mar 10, 2020·3 cites·19 claims
- 0283US10919158B2Three-dimensional electromechanical adhesive devices and related systems and methodsMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Granted Feb 16, 2021·2 cites·20 claims
- 0379US10118426B2Nanoporous stamp for flexographic printingMASSACHUSETTS INST TECHNOLOGY·Filed 2015·Granted Nov 6, 2018·3 cites·17 claims
- 0473US2025229377A1Fixed-abrasive pad using vertically aligned carbon nanotubes and fabrication method for the sameKOREA ADVANCED INST SCI & TECH·Filed 2025·Application pending·0 cites
- 0572US11396196B2Apparatus and methods for contact-printing using electrostatic nanoporous stampsMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted Jul 26, 2022·1 cites·29 claims
- 0668US2022355435A1Fixed-abrasive pad using vertically aligned carbon nanotubes and fabrication method for the sameKOREA ADVANCED INST SCI & TECH·Filed 2021·Application pending·0 cites
- 0757US11973229B2Anode for lithium metal battery, manufacturing method of the same, lithium metal battery including the sameKOREA ADVANCED INST SCI & TECH·Filed 2021·Granted Apr 30, 2024·0 cites·7 claims
- 0857US11535006B2Nanocomposite surfaces with electrically switchable adhesionMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted Dec 27, 2022·0 cites·40 claims
- 0950US2024253178A1Composite polishing pad including carbon nanotubes, and method for producing sameKPX CHEMICAL CO LTD·Filed 2021·Application pending·0 cites
- 1050US2024217056A1Composite polishing pad including highly abrasion-resistant thin film coating bound with carbon nanotubes, and method for producing sameKPX CHEMICAL CO LTD·Filed 2021·Application pending·0 cites
- 1147US2023219191A1Polishing pad, chemical mechanical polishing apparatus including the same, and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1242US11926041B2Three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing, design and manufacturing method thereof using 3D printingKOREA ADVANCED INST SCI & TECH·Filed 2020·Granted Mar 12, 2024·0 cites·12 claims
- 1334US10828878B2Systems and methods for electromechanical transfer printing of two dimensional materialsMASSACHUSETTS INST TECHNOLOGY·Filed 2018·Granted Nov 10, 2020·0 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →