Inventor · disambiguated record
Michael Huettinger
Also filed as: HUETTINGER MICHAEL
6 granted patents·4 citations·filing 2017–2020
71Inventor score
Files withINFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
6 records- 0180US10978418B2Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layerINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0278US10461056B2Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·2 cites·7 claims
- 0368US12033972B2Chip package, method of forming a chip package and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·0 cites·12 claims
- 0445US10672678B2Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 0545US9941181B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 10, 2018·0 cites·13 claims
- 0639US10497634B2Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compoundINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 3, 2019·0 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →