Inventor · disambiguated record
Tae Woo Kang
Also filed as: KANG TAE WOO
11 granted patents·10 pending applications·54 citations·filing 2008–2025
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10HANWHA PREC MACH CO LTD3HYUNDAI MOBIS CO LTD2HYUNDAI MOTOR CO LTD2LINTECH CORP2
Top patents by PatentIndex Score
21 records- 0195US10325882B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 18, 2019·38 cites·19 claims
- 0282US9343535B2Semiconductor packages having a guide wall and related systems and methodsLEE JUNG-DO·Filed 2013·Granted May 17, 2016·8 cites·15 claims
- 0379US10801741B2Air-conditioning systemSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 13, 2020·2 cites·2 claims
- 0478US10607971B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 31, 2020·2 cites·23 claims
- 0570US2025162450A1Apparatus, system and method for predicting state of charge of batteryHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0665US8003487B2Methods of manufacturing a semiconductor device using a layer suspended across a trenchSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 23, 2011·4 cites·13 claims
- 0763US12438116B2Bonding apparatus and method of controlling the sameHANWHA PREC MACH CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·17 claims
- 0862US2025286439A1Cooling guide and motor including the sameHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 0961US2025079939A1Cooling guide structure of motorHYUNDAI MOBIS CO LTD·Filed 2024·Application pending·0 cites
- 1059US11171128B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·15 claims
- 1159US2025224243A1Vehicle control device and method thereofHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1252US2023092257A1Modularized bonding apparatusHANWHA PREC MACH CO LTD·Filed 2022·Application pending·0 cites
- 1350US2023087198A1Hybrid bonding apparatus and hybrid bonding method using the sameHANWHA PREC MACH CO LTD·Filed 2022·Application pending·0 cites
- 1449US11480349B2Outdoor unit of air conditionerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·8 claims
- 1546US11913133B2Method of manufacturing polycrystalline silicon ingot using a crucible in which an oxygen exhaust passage is formed by single crystal or polycrystalline rodsLINTECH CORP·Filed 2022·Granted Feb 27, 2024·0 cites·1 claims
- 1645US10856442B2Outdoor unit of air conditioner, cooling unit applied to the outdoor unit, and method for manufacturing the cooling unitSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 1, 2020·0 cites·13 claims
- 1744US9574999B2Outdoor unit of air conditioner and method of controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 21, 2017·0 cites·20 claims
- 1844US2015270190A1Semiconductor packageKIM JIN-GYU·Filed 2014·Application pending·0 cites
- 1943US2008214009A1Methods of Forming a Recess Structure and Methods of Manufacturing a Semiconductor Device Having a Recessed-Gate StructureSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2042US2023055541A1Method of bonding silicon parts using silicon powder and high-frequency heating deviceLINTECH CORP·Filed 2022·Application pending·0 cites
- 2136US2017294407A1Passive element package and semiconductor module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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