Inventor · disambiguated record
Thomas Wagenleitner
Also filed as: WAGENLEITNER THOMAS
46 granted patents·7 pending applications·155 citations·filing 2006–2025
97Inventor score
Files withEV GROUP E THALLNER GMBH45WAGENLEITNER THOMAS4WIMPLINGER MARKUS2BRANDSTÄTTER INGO1INFINEON TECHNOLOGIES AG1
Top patents by PatentIndex Score
53 records- 0195US10943807B2Method and device for alignment of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Mar 9, 2021·7 cites·23 claims
- 0295US10109487B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Oct 23, 2018·10 cites·10 claims
- 0394US11282706B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Mar 22, 2022·7 cites·27 claims
- 0494US9312161B2Accommodating device for retaining wafersWIMPLINGER MARKUS·Filed 2010·Granted Apr 12, 2016·20 cites·17 claims
- 0593US10279575B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted May 7, 2019·9 cites·9 claims
- 0693US9613840B2Apparatus and method for bonding substratesWAGENLEITNER THOMAS·Filed 2011·Granted Apr 4, 2017·18 cites·14 claims
- 0792US11355374B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2020·Granted Jun 7, 2022·2 cites·2 claims
- 0892US10325798B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2015·Granted Jun 18, 2019·7 cites·8 claims
- 0991US11527410B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Dec 13, 2022·1 cites·9 claims
- 1089US10692747B2Method and device for alignment of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Jun 23, 2020·6 cites·18 claims
- 1189US10636662B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Apr 28, 2020·3 cites·17 claims
- 1288US10886156B2Accomodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2019·Granted Jan 5, 2021·3 cites·1 claims
- 1388US9851645B2Device and method for aligning substratesEV GROUP E THALLNER GMBH·Filed 2013·Granted Dec 26, 2017·8 cites·14 claims
- 1487US11251045B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Feb 15, 2022·1 cites·20 claims
- 1587US11059280B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jul 13, 2021·2 cites·7 claims
- 1686US7304534B2Amplifier arrangement, and method for compensating for an offsetINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 4, 2007·25 cites·20 claims
- 1786US2025372571A1Apparatus and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2025·Application pending·0 cites
- 1885US10861699B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Dec 8, 2020·1 cites·20 claims
- 1985US10755929B2Method and device for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Aug 25, 2020·3 cites·13 claims
- 2085US2023294390A1Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2023·Application pending·0 cites
- 2184US10748770B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Aug 18, 2020·1 cites·21 claims
- 2283US11101132B2Method and device for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Aug 24, 2021·1 cites·8 claims
- 2382US11315901B2Method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2017·Granted Apr 26, 2022·3 cites·10 claims
- 2482US11121091B2Method for arranging two substratesEV GROUP E THALLNER GMBH·Filed 2017·Granted Sep 14, 2021·3 cites·11 claims
- 2582US2024213025A1Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2024·Application pending·0 cites
- 2681US10504730B2Device and method for bonding of substatesEV GROUP E THALLNER GMBH·Filed 2018·Granted Dec 10, 2019·1 cites·20 claims
- 2779US11756818B2Accommodating device for retaining wafersEV GROUP E THALLNER GMBH·Filed 2022·Granted Sep 12, 2023·0 cites·8 claims
- 2878US11697281B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 2976US11955339B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Apr 9, 2024·0 cites·17 claims
- 3074US11742205B2Method and device for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Aug 29, 2023·0 cites·23 claims
- 3174US10991609B2Method and substrate holder for the controlled bonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Apr 27, 2021·2 cites·16 claims
- 3273US10954122B2Method for bonding of at least three substratesEV GROUP E THALLNER GMBH·Filed 2017·Granted Mar 23, 2021·2 cites·13 claims
- 3372US12412865B2Apparatus and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2022·Granted Sep 9, 2025·0 cites·16 claims
- 3471US10134622B2Apparatus and method for ascertaining orientation errorsWAGENLEITNER THOMAS·Filed 2012·Granted Nov 20, 2018·2 cites·9 claims
- 3570US10755930B2Method and device for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2020·Granted Aug 25, 2020·0 cites·16 claims
- 3669US11315813B2Substrate holder and method for bonding two substratesEV GROUP E THALLNER GMBH·Filed 2015·Granted Apr 26, 2022·2 cites·7 claims
- 3769US11020950B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·2 claims
- 3869US11020951B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 3969US11020953B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·7 claims
- 4069US11020952B2Device and method for bonding substratesEV GROUP E THALLNER GMBH·Filed 2019·Granted Jun 1, 2021·0 cites·8 claims
- 4169US9595094B2Measuring form changes of a substrateWAGENLEITNER THOMAS·Filed 2011·Granted Mar 14, 2017·2 cites·13 claims
- 4267US11488851B2Method and device for alignment of substratesEV GROUP E THALLNER GMBH·Filed 2021·Granted Nov 1, 2022·0 cites·21 claims
- 4362US9464884B2Method for determining the position of a rotation axisWAGENLEITNER THOMAS·Filed 2010·Granted Oct 11, 2016·1 cites·5 claims
- 4456US12131907B2Device and method for bonding of substratesEV GROUP E THALLNER GMBH·Filed 2016·Granted Oct 29, 2024·0 cites·6 claims
- 4556US10410896B2Apparatus and method for ascertaining orientation errorsEV GROUP E THALLNER GMBH·Filed 2018·Granted Sep 10, 2019·0 cites·14 claims
- 4651US8714611B2Handling device for handling of a waferBRANDSTÄTTER INGO·Filed 2010·Granted May 6, 2014·2 cites·6 claims
- 4748US2025125152A1Method and device for compensating for distortionsEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
- 4846US11680792B2Incoming runout measurement methodEV GROUP E THALLNER GMBH·Filed 2018·Granted Jun 20, 2023·0 cites·17 claims
- 4946US2023207379A1Method and device for bonding substratesEV GROUP E THALLNER GMBH·Filed 2020·Application pending·0 cites
- 5045US2025046639A1Method and device for the alignment of a substrateEV GROUP E THALLNER GMBH·Filed 2021·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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