Inventor · disambiguated record
Lee H. Tullidge
Also filed as: TULLIDGE LEE H
3 granted patents·15 citations·filing 2005–2012
66Inventor score
Top patents by PatentIndex Score
3 records- 0170US8112884B2Method for providing an efficient thermal transfer through a printed circuit boardTULLIDGE LEE H·Filed 2007·Granted Feb 14, 2012·8 cites·11 claims
- 0261US7193863B2Electronics packaging assembly with parallel circuit boards and a vibration stiffenerHONEYWELL INT INC·Filed 2005·Granted Mar 20, 2007·5 cites·10 claims
- 0360US8575492B2Hole in pad thermal managementTULLIDGE LEE H·Filed 2012·Granted Nov 5, 2013·2 cites·5 claims
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