Inventor · disambiguated record
Wang-Ju Lee
Also filed as: LEE WANG-JU
5 granted patents·4 pending applications·53 citations·filing 2006–2016
78Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4UBGREEN CO LTD2FIRST DOME CORP1SHIN DONG-KIL1TSENG CHIEN-CHUNG1
Top patents by PatentIndex Score
9 records- 0194US8829667B2Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 9, 2014·24 cites·17 claims
- 0288US7692314B2Wafer level chip scale package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 6, 2010·20 cites·7 claims
- 0382US10364837B2Dual-shaft synchronous transmission device and transmission moduleFIRST DOME CORP·Filed 2016·Granted Jul 30, 2019·4 cites·11 claims
- 0467US7884487B2Rotation joint and semiconductor device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 8, 2011·3 cites·17 claims
- 0555US9152636B2Content protection system in storage media and method of the sameTSENG CHIEN-CHUNG·Filed 2008·Granted Oct 6, 2015·2 cites·13 claims
- 0649US2015066745A1Payment relay system and methodUBGREEN CO LTD·Filed 2012·Application pending·0 cites
- 0749US2014229381A1Financial transaction relay system using mobile terminalUBGREEN CO LTD·Filed 2012·Application pending·0 cites
- 0843US2008087995A1Flexible film semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0938US2007029674A1Board-on-chip package and stack package using the sameSHIN DONG-KIL·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →