Inventor · disambiguated record
Wan-Yu Lee
Also filed as: LEE WAN-YU
38 granted patents·4 pending applications·86 citations·filing 2012–2024
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD35TAIWAN SEMICONDUCTOR MFG4INNOLUX CORP1LEE WAN YU1TSENG CHUN HAO1
Top patents by PatentIndex Score
42 records- 0195US9036956B2Method of fabricating a polymer waveguideTSENG CHUN-HAO·Filed 2012·Granted May 19, 2015·31 cites·20 claims
- 0294US9618712B2Optical bench on substrate and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·10 cites·20 claims
- 0389US9419156B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·6 cites·18 claims
- 0486US9484211B2Etchant and etching processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 1, 2016·5 cites·20 claims
- 0584US10276471B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 0684US10156741B2Electro-optic modulator device, optical device and method of making an optical deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·2 cites·20 claims
- 0784US9478475B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·3 cites·20 claims
- 0882US10748825B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·2 cites·20 claims
- 0982US10353147B2Etchant and etching process for substrate of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 16, 2019·2 cites·20 claims
- 1082US9876127B2Backside-illuminated photodetector structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 23, 2018·3 cites·20 claims
- 1180US11088094B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 1280US10978346B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 1380US9910217B2Method of fabrication polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 6, 2018·2 cites·20 claims
- 1480US9099623B2Manufacture including substrate and package structure of optical chipTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·3 cites·21 claims
- 1578US11984410B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 1676US10408998B2Method of fabrication polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 10, 2019·1 cites·20 claims
- 1773US10539751B2Optical bench on substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 21, 2020·1 cites·20 claims
- 1872US11682637B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1972US11139282B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 5, 2021·2 cites·20 claims
- 2071US11415762B2Optical bench, method of making and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 2171US10510603B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·1 cites·20 claims
- 2271US9383513B2Waveguide structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 5, 2016·2 cites·20 claims
- 2370US10180547B2Optical bench on substrateLEE WAN YU·Filed 2012·Granted Jan 15, 2019·3 cites·20 claims
- 2467US9490133B2Etching apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 8, 2016·1 cites·20 claims
- 2566US11125940B2Method of fabrication polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 2666US10859860B2Electro-optic modulator device, optical device and method of making an optical deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
- 2764US11328972B2Temporary bonding schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 10, 2022·0 cites·15 claims
- 2863US10510909B2Backside-illuminated photodetector structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·0 cites·20 claims
- 2961US10866362B2Etchant and etching process for substrate of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 3059US10361323B2Backside-illuminated photodetector structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·0 cites·20 claims
- 3159US9523869B2Electro-optic modulator device, optical device and method of making an optical deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·0 cites·20 claims
- 3259US2025253222A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3358US9865481B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·0 cites·20 claims
- 3458US9202799B2Temporary bonding schemeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 1, 2015·0 cites·20 claims
- 3558US9153940B2Electro-optic modulator device and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·0 cites·20 claims
- 3658US2024250078A1Electronic device and method for manufacturing the sameINNOLUX CORP·Filed 2024·Application pending·0 cites
- 3757US9799528B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·0 cites·20 claims
- 3857US2025125223A1Passivation structure and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3956US10866374B2Optical bench on substrate and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 15, 2020·0 cites·20 claims
- 4056US10170387B2Temporary bonding schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 1, 2019·0 cites·20 claims
- 4155US9852915B2Etching apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·20 claims
- 4254US2024178086A1Package, package structure and method of manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →