Inventor · disambiguated record
Reinhard Mahnkopf
Also filed as: MAHNKOPF REINHARD · MAHNKOPF REINHARD ULRICH
30 granted patents·6 pending applications·178 citations·filing 1995–2025
96Inventor score
Top patents by PatentIndex Score
36 records- 0197US11855595B2Composite cascode power amplifiers for envelope tracking applicationsSKYWORKS SOLUTIONS INC·Filed 2021·Granted Dec 26, 2023·11 cites·20 claims
- 0297US9663353B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2013·Granted May 30, 2017·29 cites·16 claims
- 0392US9252077B2Package vias for radio frequency antenna connectionsMOLZER WOLFGANG·Filed 2013·Granted Feb 2, 2016·32 cites·17 claims
- 0489US12231099B2Composite cascode power amplifiers for envelope tracking applicationsSKYWORKS SOLUTIONS INC·Filed 2023·Granted Feb 18, 2025·1 cites·20 claims
- 0585US9564400B2Methods of forming stacked microelectronic dice embedded in a microelectronic substrateINTEL CORP·Filed 2016·Granted Feb 7, 2017·4 cites·19 claims
- 0680US9856136B2Chip arrangement and method for manufacturing a chip arrangementINTEL MOBILE COMM GMBH·Filed 2013·Granted Jan 2, 2018·5 cites·34 claims
- 0779US9209143B2Die edge side connectionINTEL IP CORP·Filed 2013·Granted Dec 8, 2015·5 cites·24 claims
- 0878US9056763B2Stress buffer layer for integrated microelectromechanical systems (MEMS)GEISSLER CHRISTIAN·Filed 2013·Granted Jun 16, 2015·5 cites·35 claims
- 0978US8076228B2Low noise transistor and method of making sameBERTHOLD ADRIAN·Filed 2007·Granted Dec 13, 2011·9 cites·105 claims
- 1077US9888577B2Passive electrical devices with a polymer carrierINTEL CORP·Filed 2014·Granted Feb 6, 2018·3 cites·20 claims
- 1176US9550670B2Stress buffer layer for integrated microelectromechanical systems (MEMS)INTEL IP CORP·Filed 2015·Granted Jan 24, 2017·2 cites·22 claims
- 1275US10403602B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL CORP·Filed 2017·Granted Sep 3, 2019·2 cites·9 claims
- 1371US2025158583A1Composite cascode power amplifiers for envelope tracking applicationsSKYWORKS SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 1470US9373588B2Stacked microelectronic dice embedded in a microelectronic substrateINTEL CORP·Filed 2013·Granted Jun 21, 2016·2 cites·20 claims
- 1564US8076738B2Integrally fabricated micromachine and logic elementsKOLB STEFAN·Filed 2007·Granted Dec 13, 2011·2 cites·12 claims
- 1662US5587599ABipolar transistor and manufacturing methodSIEMENS AG·Filed 1995·Granted Dec 24, 1996·25 cites·17 claims
- 1759US5623155AMOSFET on SOI substrateSIEMENS AG·Filed 1995·Granted Apr 22, 1997·19 cites·6 claims
- 1858US11018114B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL IP CORP·Filed 2019·Granted May 25, 2021·0 cites·25 claims
- 1958US10301176B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2017·Granted May 28, 2019·0 cites·29 claims
- 2057US10150668B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2017·Granted Dec 11, 2018·0 cites·20 claims
- 2150US8415191B2Integrally fabricated micromachine and logic elementsKOLB STEFAN·Filed 2011·Granted Apr 9, 2013·0 cites·5 claims
- 2249US11456116B2Magnetic coils in locally thinned silicon bridges and methods of assembling sameINTEL CORP·Filed 2017·Granted Sep 27, 2022·0 cites·18 claims
- 2348US11410908B2Integrated circuit devices with front-end metal structuresINTEL IP CORP·Filed 2018·Granted Aug 9, 2022·0 cites·22 claims
- 2448US8907480B2Chip arrangementsINTEL MOBILE COMM GMBH·Filed 2013·Granted Dec 9, 2014·0 cites·23 claims
- 2547US10141265B2Bent-bridge semiconductive apparatusINTEL IP CORP·Filed 2016·Granted Nov 27, 2018·0 cites·22 claims
- 2647US6958282B1SOI semiconductor configuration and method of fabricating the sameSIEMENS AG·Filed 1999·Granted Oct 25, 2005·15 cites·10 claims
- 2746US11145577B2Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatusINTEL IP CORP·Filed 2016·Granted Oct 12, 2021·0 cites·20 claims
- 2844US11037855B2Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatusINTEL IP CORP·Filed 2016·Granted Jun 15, 2021·0 cites·11 claims
- 2944US2015282367A1Electronic assembly that includes stacked electronic componentsBARTH HANS-JOACHIM·Filed 2014·Application pending·0 cites
- 3042US11764187B2Semiconductor packages, and methods for forming semiconductor packagesINTEL CORP·Filed 2017·Granted Sep 19, 2023·0 cites·14 claims
- 3142US2014252632A1Semiconductor devicesBARTH HANS-JOACHIM·Filed 2013·Application pending·0 cites
- 3242US2016225694A1High conductivity high frequency via for electronic systemsBARTH HANS-JOACHIM·Filed 2013·Application pending·0 cites
- 3340US10535578B2Semiconductor devices, and a method for forming a semiconductor deviceINTEL IP CORP·Filed 2017·Granted Jan 14, 2020·0 cites·19 claims
- 3437US2015001713A1Multiple level redistribution layer for multiple chip integrationGOETZ EDMUND·Filed 2013·Application pending·0 cites
- 3536US6232220B1Method for fabricating a semiconductor component having a low contact resistance with respect to heavily doped zonesINFINEON TECHNOLOGIES AG·Filed 1999·Granted May 15, 2001·7 cites·6 claims
- 3635US2004053439A1Method for producing low-resistance ohmic contacts between substrates and wells in CMOS integrated circuitsINFINEON TECHNOLOGIES CORP·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →