Inventor · disambiguated record
Yiyi Ma
Also filed as: MA YIYI
11 granted patents·6 pending applications·66 citations·filing 1998–2024
86Inventor score
Top patents by PatentIndex Score
17 records- 0184US8497587B2Thermally enhanced expanded wafer level package ball grid array structure and method of making the sameMA YIYI·Filed 2009·Granted Jul 30, 2013·20 cites·14 claims
- 0281US9576912B1Wafer level chip scale package (WLCSP) having edge protectionST MICROELECTRONICS PTE LTD·Filed 2015·Granted Feb 21, 2017·4 cites·15 claims
- 0373US6007743ANickel powder and process for preparing the sameSHOEI CHEMICAL IND CO·Filed 1998·Granted Dec 28, 1999·35 cites·8 claims
- 0462US9379034B1Method of making an electronic device including two-step encapsulation and related devicesST MICROELECTRONICS PTE LTD·Filed 2014·Granted Jun 28, 2016·1 cites·21 claims
- 0559US10658238B2Semiconductor packages having an electric device with a recessST MICROELECTRONICS PTE LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
- 0654US9824924B2Semiconductor packages having an electric device with a recessST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 21, 2017·0 cites·16 claims
- 0753US6528166B2Nickel composite particle and production process thereforSHOEI CHEMICAL IND CO·Filed 2001·Granted Mar 4, 2003·2 cites·13 claims
- 0851US12284051B1Computer network system and computer systemUNIV ZHEJIANG·Filed 2024·Granted Apr 22, 2025·0 cites·7 claims
- 0950US2025166149A1A method, medium, and device for estimating the length of pipeline cracks based on video imagesUNIV ZHEJIANG·Filed 2023·Application pending·0 cites
- 1045US2024208718A1Water tank, ventilation area design method thereof, storage medium and electronic apparatusUNIV ZHEJIANG·Filed 2024·Application pending·0 cites
- 1143US9679870B2Integrated circuit device with shaped leads and method of forming the deviceST MICROELECTRONICS PTE LTD·Filed 2014·Granted Jun 13, 2017·0 cites·10 claims
- 1242US2015084171A1No-lead semiconductor package and method of manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2013·Application pending·0 cites
- 1340US8907465B2Methods and devices for packaging integrated circuitsST MICROELECTRONICS PTE LTD·Filed 2013·Granted Dec 9, 2014·0 cites·18 claims
- 1437US6403218B1Nickel composite particle and production process thereforSHOEI CHEMICAL IND CO·Filed 1999·Granted Jun 11, 2002·4 cites·4 claims
- 1537US2013001740A1Heat spreader for thermally enhanced flip-chip ball grid array packageST MICROELECTRONICS PTE LTD·Filed 2011·Application pending·0 cites
- 1636US2013093072A1Leadframe pad design with enhanced robustness to die crack failureZHANG XUEREN·Filed 2011·Application pending·0 cites
- 1733US2016293512A1Electronic device with dummy ic die and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Application pending·0 cites
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