Inventor · disambiguated record
Puwei Liu
Also filed as: LIU PUWEI
22 granted patents·12 pending applications·603 citations·filing 2001–2023
96Inventor score
Top patents by PatentIndex Score
34 records- 0198US7517925B2Benzoxazines, thermosetting resins comprised thereof, and methods for use thereofHENKEL CORP·Filed 2003·Granted Apr 14, 2009·87 cites·13 claims
- 0298US6743852B2Benzoxazines, thermosetting resins comprised thereof, and methods for use thereofHENKEL CORP·Filed 2001·Granted Jun 1, 2004·102 cites·29 claims
- 0395US6963001B2Low shrinkage thermosetting resin compositions and methods of use thereforHENKEL CORP·Filed 2003·Granted Nov 8, 2005·41 cites·40 claims
- 0493US7199249B2Free radically polymerizable coupling agentsHENKEL CORP·Filed 2002·Granted Apr 3, 2007·52 cites·13 claims
- 0592US8835574B2Adhesive compositions for use in die attach applicationsHENKEL CORP·Filed 2012·Granted Sep 16, 2014·12 cites·3 claims
- 0692US6960636B2Thermosetting resin compositions containing maleimide and/or vinyl compoundsHENKEL CORP·Filed 2003·Granted Nov 1, 2005·40 cites·24 claims
- 0791US6946523B2Heterobifunctional monomers and uses thereforHENKEL CORP·Filed 2003·Granted Sep 20, 2005·61 cites·41 claims
- 0890US7176044B2B-stageable die attach adhesivesHENKEL CORP·Filed 2003·Granted Feb 13, 2007·72 cites·35 claims
- 0989US7550825B2Interlayer dielectric and pre-applied die attach adhesive materialsHENKEL CORP·Filed 2007·Granted Jun 23, 2009·18 cites·10 claims
- 1085US7312534B2Interlayer dielectric and pre-applied die attach adhesive materialsHENKEL CORP·Filed 2003·Granted Dec 25, 2007·47 cites·29 claims
- 1184US6831132B2Film adhesives containing maleimide compounds and methods for use thereofHENKEL CORP·Filed 2002·Granted Dec 14, 2004·40 cites·29 claims
- 1280US7037447B1Conductive ink compositionsHENKEL CORP·Filed 2003·Granted May 2, 2006·20 cites·34 claims
- 1376US7851254B2B-stageable die attach adhesivesHENKEL CORP·Filed 2007·Granted Dec 14, 2010·9 cites·7 claims
- 1470US9427829B2Di- or poly-functional electron deficient olefins coated metal powders for solder pasteHenkel IP & Holding GmbH·Filed 2014·Granted Aug 30, 2016·1 cites·16 claims
- 1570US2023174823A1Low reflectance dual cure adhesive compositionsHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 1667US10189121B2Organic acid-or latent organic acid-functionalized polymer-coated metal powders for solder pastesHenkel IP & Holding GmbH·Filed 2017·Granted Jan 29, 2019·0 cites·4 claims
- 1766US2022325151A1Two part curable compositionsHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 1862US8338536B2Adhesive compositions for use in die attach applicationsNGUYEN MY·Filed 2010·Granted Dec 25, 2012·1 cites·10 claims
- 1962US2022380645A1High creep recovery, low modulus polymer systems and methods of making themHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 2060US11174419B2Light stable transparent adhesive compositions and methods for use thereofHenkel IP & Holding GmbH·Filed 2019·Granted Nov 16, 2021·0 cites·15 claims
- 2160US7973158B2Method of preparing benzoxazinesHENKEL CORP·Filed 2009·Granted Jul 5, 2011·0 cites·11 claims
- 2252US9682447B2Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastesLIU PUWEI·Filed 2010·Granted Jun 20, 2017·0 cites·9 claims
- 2352US2014220337A1Adhesive compositions for use in die attach applicationsHenkel US IP LLC·Filed 2013·Application pending·0 cites
- 2447US2014264165A1Oxetane-containing compounds and compositions thereofHENKEL CORP·Filed 2013·Application pending·0 cites
- 2547US2010140542A1Benzoxazine containing compositions of matter and curable compositions made therewithHENKEL CORP·Filed 2009·Application pending·0 cites
- 2646US2018127537A1Resins and compositions for high temperature applicationsHenkel IP & Holding GmbH·Filed 2017·Application pending·0 cites
- 2744US8698320B2Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devicesNGUYEN MY NHU·Filed 2009·Granted Apr 15, 2014·0 cites·17 claims
- 2842US2003208016A1Radical polymerizable compositions containing polycyclic olefinsHENKEL LOCTITE CORP·Filed 2003·Application pending·0 cites
- 2941US2011301291A1Oxazoline and/or oxazine compositionsLIU PUWEI·Filed 2011·Application pending·0 cites
- 3040US8486498B2Thermally decomposable polymer coated metal powdersLIU PUWEI·Filed 2011·Granted Jul 16, 2013·0 cites·13 claims
- 3139US2005107542A1Film adhesives containing maleimide compounds and methods for use thereofHENKEL CORP·Filed 2004·Application pending·0 cites
- 3239US2014209951A1Oxetane-containing compounds and compositions thereofHenkel IP & Holding GmbH·Filed 2014·Application pending·0 cites
- 3332US8278396B2Curing agents for epoxy resinsZHU PUKUN·Filed 2011·Granted Oct 2, 2012·0 cites·1 claims
- 3432US2005288457A1Co-curable compositionsLIU PUWEI·Filed 2003·Application pending·0 cites
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