Inventor · disambiguated record
James T. Huneke
Also filed as: HUNEKE JAMES T
8 granted patents·1 pending application·156 citations·filing 1982–2014
89Inventor score
Files withHENKEL CORP3DESIGNER MOLECULES INC2AT & T TECHNOLOGIES INC1DERSHEM STEPHEN M1HUNEKE JAMES T1
Top patents by PatentIndex Score
9 records- 0193US8415812B2Materials and methods for stress reduction in semiconductor wafer passivation layersDERSHEM STEPHEN M·Filed 2010·Granted Apr 9, 2013·10 cites·20 claims
- 0289US7550825B2Interlayer dielectric and pre-applied die attach adhesive materialsHENKEL CORP·Filed 2007·Granted Jun 23, 2009·18 cites·10 claims
- 0387US8710682B2Materials and methods for stress reduction in semiconductor wafer passivation layersDESIGNER MOLECULES INC·Filed 2013·Granted Apr 29, 2014·8 cites·22 claims
- 0485US7312534B2Interlayer dielectric and pre-applied die attach adhesive materialsHENKEL CORP·Filed 2003·Granted Dec 25, 2007·47 cites·29 claims
- 0584US8399974B1Methods of dicing stacked shingled strip constructions to form stacked die packagesHUNEKE JAMES T·Filed 2009·Granted Mar 19, 2013·17 cites·4 claims
- 0664US4574031AAdditive processing electroless metal plating using aqueous photoresistAT & T TECHNOLOGIES INC·Filed 1985·Granted Mar 4, 1986·25 cites·10 claims
- 0762US4374869ASelective metal etch techniqueWESTERN ELECTRIC CO·Filed 1982·Granted Feb 22, 1983·21 cites·9 claims
- 0860US7582510B2Electronic packaging materials for use with low-k dielectric-containing semiconductor devicesHENKEL CORP·Filed 2004·Granted Sep 1, 2009·10 cites·12 claims
- 0958US2014275413A1Heat and moisture resistant anaerobic adhesives and sealantsDESIGNER MOLECULES INC·Filed 2014·Application pending·0 cites
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