Inventor · disambiguated record
Eiichi Hosomi
Also filed as: HOSOMI EIICHI
27 granted patents·10 pending applications·1,039 citations·filing 1995–2015
97Inventor score
Top patents by PatentIndex Score
37 records- 0195US6740981B2Semiconductor device including memory unit and semiconductor module including memory unitsTOKYO SHIBAURA ELECTRIC CO·Filed 2001·Granted May 25, 2004·117 cites·20 claims
- 0293US6111317AFlip-chip connection type semiconductor integrated circuit deviceTOSHIBA KK·Filed 1997·Granted Aug 29, 2000·157 cites·16 claims
- 0389US7531751B2Method and system for an improved package substrate for use with a semiconductor packageTOSHIBA KK·Filed 2005·Granted May 12, 2009·18 cites·13 claims
- 0489US6159837AManufacturing method of semiconductor deviceTOSHIBA KK·Filed 1999·Granted Dec 12, 2000·106 cites·16 claims
- 0589US5801447AFlip chip mounting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·107 cites·5 claims
- 0689US5631499ASemiconductor device comprising fine bump electrode having small side etch portion and stable characteristicsTOSHIBA KK·Filed 1996·Granted May 20, 1997·118 cites·12 claims
- 0785US5773888ASemiconductor device having a bump electrode connected to an inner leadTOSHIBA KK·Filed 1995·Granted Jun 30, 1998·84 cites·7 claims
- 0884US6469373B2Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method thereforTOSHIBA KK·Filed 2001·Granted Oct 22, 2002·45 cites·49 claims
- 0981US5747881ASemiconductor device, method of fabricating the same and copper leadsTOSHIBA KK·Filed 1996·Granted May 5, 1998·54 cites·28 claims
- 1080US6376907B1Ball grid array type package for semiconductor deviceTOSHIBA KK·Filed 1998·Granted Apr 23, 2002·60 cites·26 claims
- 1180US5825081ATape carrier and assembly structure thereofTOSHIBA KK·Filed 1996·Granted Oct 20, 1998·60 cites·18 claims
- 1278US7910956B2Semiconductor device with interface circuit and method of configuring semiconductor devicesTOSHIBA KK·Filed 2009·Granted Mar 22, 2011·5 cites·10 claims
- 1378US7087988B2Semiconductor packaging apparatusTOSHIBA KK·Filed 2002·Granted Aug 8, 2006·25 cites·22 claims
- 1471US6768206B2Organic substrate for flip chip bondingTOSHIBA KK·Filed 2002·Granted Jul 27, 2004·17 cites·16 claims
- 1570US7817439B2System and apparatus for power distribution for a semiconductor deviceTOSHIBA KK·Filed 2006·Granted Oct 19, 2010·4 cites·9 claims
- 1670US6049130ASemiconductor device using gold bumps and copper leads as bonding elementsTOSHIBA KK·Filed 1997·Granted Apr 11, 2000·32 cites·3 claims
- 1765US7492570B2Systems and methods for reducing simultaneous switching noise in an integrated circuitTOSHIBA KK·Filed 2005·Granted Feb 17, 2009·3 cites·16 claims
- 1861US6551854B2Semiconductor device having bump electrodes and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted Apr 22, 2003·10 cites·26 claims
- 1957US8183599B2Semiconductor device with interface circuit and method of configuring semiconductor devicesHOSOMI EIICHI·Filed 2011·Granted May 22, 2012·1 cites·19 claims
- 2049US6960494B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Nov 1, 2005·4 cites·5 claims
- 2147US8723334B2Semiconductor device including semiconductor packageTOSHIBA KK·Filed 2013·Granted May 13, 2014·0 cites·17 claims
- 2245US7501698B2Method and system for an improved power distribution network for use with a semiconductor deviceTOSHIBA KK·Filed 2004·Granted Mar 10, 2009·1 cites·27 claims
- 2345US2008105987A1Semiconductor device having interposer formed on chipTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2443US9153510B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Oct 6, 2015·0 cites·14 claims
- 2543US6836012B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 28, 2004·2 cites·7 claims
- 2643US2014246781A1Semiconductor device, method of forming a packaged chip device and chip packageTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2741US7227260B2Method and system for a pad structure for use with a semiconductor packageTOSHIBA KK·Filed 2004·Granted Jun 5, 2007·4 cites·9 claims
- 2840US2006286754A1Semiconductor device with interface circuit and method of configuring semiconductor devicesHOSOMI EIICHI·Filed 2005·Application pending·0 cites
- 2938US2011065239A1Method of fabricating a semiconductor device and semiconductor production equipmentTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3038US2007271473A1Method and system for a semiconductor device with multiple voltage sensors and power control of semiconductor device with multiple voltage sensorsHOSOMI EIICHI·Filed 2006·Application pending·0 cites
- 3137US2008054724A1Method and system for improved power distribution in a semiconductor device through use of multiple power suppliesHOSOMI EIICHI·Filed 2006·Application pending·0 cites
- 3236US2007245556A1A method and system for plated thru hole placement in a substrateHOSOMI EIICHI·Filed 2006·Application pending·0 cites
- 3335US6061466AApparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leadsTOSHIBA KK·Filed 1996·Granted May 9, 2000·5 cites·15 claims
- 3435US2006237829A1Method and system for a semiconductor package with an air ventHOSOMI EIICHI·Filed 2005·Application pending·0 cites
- 3534US2016079216A1Semiconductor device, and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3634US2016079219A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3730US5615822AMethod and apparatus for controlling bonding load of fine lead electrodeTOSHIBA KK·Filed 1995·Granted Apr 1, 1997·0 cites·19 claims
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