Inventor · disambiguated record
Andrew Jefferson Mawer
Also filed as: MAWER ANDREW J · MAWER ANDREW JEFFERSON
3 granted patents·3 pending applications·125 citations·filing 1994–2021
72Inventor score
Top patents by PatentIndex Score
6 records- 0191US6552436B2Semiconductor device having a ball grid array and method thereforMOTOROLA INC·Filed 2000·Granted Apr 22, 2003·83 cites·16 claims
- 0268US5511306AMasking of circuit board vias to reduce heat-induced board and chip carrier package warp during wavesolder processCOMPAQ COMPUTER CORP·Filed 1994·Granted Apr 30, 1996·42 cites·7 claims
- 0348US2023137977A1Stacking a semiconductor die and chip-scale-package unitNXP BV·Filed 2021·Application pending·0 cites
- 0446US11908784B2Packaged semiconductor device assemblyNXP USA INC·Filed 2020·Granted Feb 20, 2024·0 cites·20 claims
- 0536US2003102535A1Semiconductor device having a ball grid array and method thereforFiled 2003·Application pending·0 cites
- 0635US2019157222A1Package with isolation structureNXP USA INC·Filed 2017·Application pending·0 cites
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