Inventor · disambiguated record
Chen Seong Chua
Also filed as: CHUA CHEN SEONG
1 granted patent·1 pending application·0 citations·filing 2011–2011
1Inventor score
Technology areasH10W
Files withLEE LEE HAN MENG@EUGENE2
Top patents by PatentIndex Score
2 records- 0129US2013127029A1Two level leadframe with upset ball bonding surface and device packageLEE LEE HAN MENG EUGENE·Filed 2011·Application pending·0 cites
- 0224US8847370B2Exposed die package that helps protect the exposed die from damageLEE LEE HAN MENG EUGENE·Filed 2011·Granted Sep 30, 2014·0 cites·6 claims
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