Inventor · disambiguated record
Yoshiaki Yamada
Also filed as: YAMADA YOSHIAKI
105 granted patents·18 pending applications·1,884 citations·filing 1979–2019
99Inventor score
Files withSEIKO EPSON CORP28NEC CORP22NIPPON TELEGRAPH & TELEPHONE11HITACHI LTD8MITSUBISHI ELECTRIC CORP7
Top patents by PatentIndex Score
123 records- 0194US5804505AMethod of producing semiconductor device having buried contact structureNEC CORP·Filed 1996·Granted Sep 8, 1998·301 cites·7 claims
- 0293US7384126B2Liquid drop discharge head, discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter, method of manufacture thereof, and device for manufacture thereof; and device incorporating backing, method of manufacture thereof, and device for manufacture thereofSEIKO EPSON CORP·Filed 2005·Granted Jun 10, 2008·13 cites·20 claims
- 0393US5827778AMethod of manufacturing a semiconductor device using a silicon fluoride oxide filmNEC CORP·Filed 1996·Granted Oct 27, 1998·141 cites·17 claims
- 0492US5910020AMethod for fabricating a semiconductor device having a refractory metal pillar for electrical connectionNEC CORP·Filed 1996·Granted Jun 8, 1999·131 cites·22 claims
- 0591US5900645ASemiconductor device and method of testing the sameNEC CORP·Filed 1997·Granted May 4, 1999·101 cites·9 claims
- 0689US7455389B2Ejecting method and ejecting apparatusSEIKO EPSON CORP·Filed 2005·Granted Nov 25, 2008·14 cites·15 claims
- 0788US6921148B2Liquid drop discharge head, discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter, method of manufacture thereof, and device for manufacture thereof; and device incorporating backing, method of manufacture thereof, and device for manufacture thereofSEIKO EPSON CORP·Filed 2003·Granted Jul 26, 2005·28 cites·15 claims
- 0886US7101440B2Ejecting method and ejecting apparatusSEIKO EPSON CORP·Filed 2002·Granted Sep 5, 2006·19 cites·23 claims
- 0984US7510272B2Apparatus and method of assembling head unit, of positioning liquid droplet ejection head, and of fixing liquid droplet ejection head; as well as method of manufacturing LCD device, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, organic EL, spacer, metallic wire, lens, resist, and light diffusion memberSEIKO EPSON CORP·Filed 2005·Granted Mar 31, 2009·6 cites·20 claims
- 1083US6353786B1Braking device for an electrically-powered car that uses a load of an electrical motor as a braking forceNISSAN DIESEL·Filed 1999·Granted Mar 5, 2002·35 cites·3 claims
- 1183US5716477AThermal image transfer recording medium and recording method using the sameRICOH KK·Filed 1995·Granted Feb 10, 1998·35 cites·19 claims
- 1282US6627996B1Semiconductor device having fluorine containing silicon oxide layer as dielectric for wiring pattern having anti-reflective layer and insulating layer thereonNEC ELECTRONICS CORP·Filed 2000·Granted Sep 30, 2003·24 cites·7 claims
- 1381US8770327B2Accessory drive mechanism for hybrid vehicleYAMADA YOSHIAKI·Filed 2010·Granted Jul 8, 2014·11 cites·2 claims
- 1481US6991315B2Ejecting method and ejecting apparatusSEIKO EPSON CORP·Filed 2002·Granted Jan 31, 2006·22 cites·18 claims
- 1580US5744016ASputtering apparatusNEC CORP·Filed 1997·Granted Apr 28, 1998·38 cites·17 claims
- 1677US8376637B2Photoresist coating and developing apparatus, substrate transfer method and interface apparatusTOKYO ELECTRON LTD·Filed 2010·Granted Feb 19, 2013·4 cites·28 claims
- 1777US6328122B1Hybrid vehicle comprising emergency drive deviceNISSAN DIESEL MOTOR CO·Filed 1998·Granted Dec 11, 2001·60 cites·6 claims
- 1877US5643422AReactive sputtering system for depositing titanium nitride without formation of titanium nitride on titanium target and process of depositing titanium nitride layerNEC CORP·Filed 1995·Granted Jul 1, 1997·30 cites·13 claims
- 1977US5470792AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1994·Granted Nov 28, 1995·55 cites·39 claims
- 2076US7087276B2Thermal transfer recording medium, thermal transfer recording method and recorded articleRICOH KK·Filed 2005·Granted Aug 8, 2006·2 cites·14 claims
- 2175US8585523B2Power transmitting mechanism for hybrid vehicleYAMADA YOSHIAKI·Filed 2009·Granted Nov 19, 2013·10 cites·2 claims
- 2275US8007968B2Substrate processing method, program, computer-readable storage medium and substrate processing systemTOKYO ELECTRON LTD·Filed 2007·Granted Aug 30, 2011·5 cites·18 claims
- 2375US7040741B2Apparatus and method of assembling head unit, of positioning liquid droplet ejection head, and of fixing liquid droplet ejection head; as well as method of manufacturing LCD device, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, organic EL, spacer, metallic wire, lens, resist, and light diffusion memberSEIKO EPSON CORP·Filed 2002·Granted May 9, 2006·13 cites·12 claims
- 2474US10249589B2Semiconductor device including conductive layer and conductive pillar disposed on conductive layer and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 2, 2019·2 cites·14 claims
- 2574US7322394B2Apparatus and method of assembling head unit and of fixing liquid droplet ejection headSEIKO EPSON CORP·Filed 2002·Granted Jan 29, 2008·15 cites·24 claims
- 2673US6995969B2Electric double-layer capacitorNISSAN DIESEL MOTOR CO·Filed 2003·Granted Feb 7, 2006·15 cites·10 claims
- 2773US6959502B2Drying apparatus and workpiece processing apparatus having the sameSEIKO EPSON CORP·Filed 2003·Granted Nov 1, 2005·14 cites·10 claims
- 2873US6440828B1Process of fabricating semiconductor device having low-resistive contact without high temperature heat treatmentNEC CORP·Filed 1997·Granted Aug 27, 2002·37 cites·8 claims
- 2972US6449530B1Semiconductor wafer carrier, semiconductor wafer carrier automatic transfer system and method for producing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 10, 2002·14 cites·10 claims
- 3072US6250767B1Light guide plate, surface light source and display using the sameSANYO ELECTRIC CO·Filed 1999·Granted Jun 26, 2001·46 cites·17 claims
- 3172US5997398ASemiconductor wafer storage apparatus and semiconductor device fabricating apparatus using said apparatusMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 7, 1999·41 cites·3 claims
- 3271US6787913B2Ohmic contact plug having an improved crack free TiN barrier metal in a contact hole and method of forming the sameNEC ELECTRONICS CORP·Filed 2001·Granted Sep 7, 2004·11 cites·8 claims
- 3371US6130154ASemiconductor device and fabrication process thereofNEC CORP·Filed 1998·Granted Oct 10, 2000·34 cites·14 claims
- 3470US7378790B2Color display substrate, color filter substrate, color luminescent substrate, manufacturing method of color display substrate, electro-optical apparatus, electronic device, film-forming method, film-forming apparatus, and display motherboardSEIKO EPSON CORP·Filed 2002·Granted May 27, 2008·12 cites·61 claims
- 3570US5571001AElectrically-powered water-immersed pumpTAIKO KIKAI IND CO LTD·Filed 1995·Granted Nov 5, 1996·35 cites·6 claims
- 3669US10250348B2Optical transport system and resource optimization methodNIPPON TELEGRAPH & TELEPHONE·Filed 2015·Granted Apr 2, 2019·2 cites·14 claims
- 3768US9490710B2Power supply device for supplying power to a load by combining a secondary battery and a capacitorVOLVO TRUCK CORP·Filed 2012·Granted Nov 8, 2016·3 cites·8 claims
- 3868US8430777B2Power transmission mechanism for parallel hybrid vehicleYAMADA YOSHIAKI·Filed 2009·Granted Apr 30, 2013·11 cites·1 claims
- 3968US6344411B1OHMIC contact plug having an improved crack free tin barrier metal in a contact hole and method of forming the sameNEC CORP·Filed 1998·Granted Feb 5, 2002·27 cites·40 claims
- 4067US9520806B2Power supply device for supplying power to a load by combining a secondary battery and a capacitorVOLVO TRUCK CORP·Filed 2012·Granted Dec 13, 2016·3 cites·3 claims
- 4165US7901149B2Substrate processing method, program, computer-readable recording medium, and substrate processing systemTOKYO ELECTRON LTD·Filed 2007·Granted Mar 8, 2011·2 cites·14 claims
- 4265US5543357AProcess of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metalNEC CORP·Filed 1994·Granted Aug 6, 1996·27 cites·5 claims
- 4364US8961351B2Continuously variable transmissionYAMADA YOSHIAKI·Filed 2011·Granted Feb 24, 2015·2 cites·3 claims
- 4463US10200116B2Multi-lane transmission device and multi-lane transmission methodNIPPON TELEGRAPH & TELEPHONE·Filed 2016·Granted Feb 5, 2019·1 cites·6 claims
- 4562US9627999B2Power supply deviceVOLVO TRUCK CORP·Filed 2012·Granted Apr 18, 2017·2 cites·10 claims
- 4662US7036906B2Liquid droplet ejection apparatus, method of manufacturing electrooptic device, electrooptic device and electronic deviceSEIKO EPSON CORP·Filed 2003·Granted May 2, 2006·8 cites·6 claims
- 4762US6661108B1Hybrid drive deviceNISSAN DIESEL·Filed 1999·Granted Dec 9, 2003·29 cites·8 claims
- 4862US5661558AOptical detector for flowing sample and optical detection method for flowing sampleHITACHI LTD·Filed 1995·Granted Aug 26, 1997·29 cites·12 claims
- 4962US4316758AApparatus of manufacturing plywoodMEINAN MACHINERY WORKS·Filed 1979·Granted Feb 23, 1982·18 cites·7 claims
- 5061US7651285B2Edge exposure apparatus, coating and developing apparatus, edge exposure method and coating and developing method, and storage mediumTOKYO ELECTRON LTD·Filed 2007·Granted Jan 26, 2010·1 cites·10 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
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