Inventor · disambiguated record
Kiyokazu Moriizumi
Also filed as: MORIIZUMI KIYOKAZU
20 granted patents·5 pending applications·508 citations·filing 1989–2018
95Inventor score
Top patents by PatentIndex Score
25 records- 0195US7222420B2Method for making a front and back conductive substrateFUJITSU LTD·Filed 2004·Granted May 29, 2007·107 cites·4 claims
- 0293US6410983B1Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chipFUJITSU LTD·Filed 2000·Granted Jun 25, 2002·84 cites·13 claims
- 0392US6399897B1Multi-layer wiring substrateFUJITSU LTD·Filed 2000·Granted Jun 4, 2002·63 cites·6 claims
- 0489US7579553B2Front-and-back electrically conductive substrateFUJITSU LTD·Filed 2001·Granted Aug 25, 2009·50 cites·3 claims
- 0585US6485814B1High density thin film circuit board and method of production thereofFUJITSU LTD·Filed 2000·Granted Nov 26, 2002·35 cites·9 claims
- 0677US7298605B2Electrolytic capacitorFUJITSU LTD·Filed 2005·Granted Nov 20, 2007·10 cites·3 claims
- 0776US9307686B2Electronic component and electronic component assembly apparatusTAKADA KATSUMI·Filed 2012·Granted Apr 5, 2016·5 cites·7 claims
- 0873US6717262B1Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of timesFUJITSU LTD·Filed 2000·Granted Apr 6, 2004·14 cites·10 claims
- 0971US6526654B1Method of producing double-sided circuit boardFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·20 cites·12 claims
- 1064US5608192AMultilayer thin-film wiring boardFUJITSU LTD·Filed 1995·Granted Mar 4, 1997·32 cites·15 claims
- 1163US6618239B2Key switch and keyboardFUJITSU LTD·Filed 2002·Granted Sep 9, 2003·11 cites·9 claims
- 1263US6054652AThin-film multi-layer substrate and electronic deviceFUJITSU LTD·Filed 1997·Granted Apr 25, 2000·31 cites·6 claims
- 1362US4949219AModule sealing structureFUJITSU LTD·Filed 1989·Granted Aug 14, 1990·27 cites·10 claims
- 1454US9545044B2Electronic component assembly apparatusFUJITSU LTD·Filed 2014·Granted Jan 10, 2017·0 cites·1 claims
- 1553US10614189B2Component retrieve device and component retrieve methodFUJITSU LTD·Filed 2018·Granted Apr 7, 2020·0 cites·17 claims
- 1649US9541602B2Electronic component inspection apparatus and methodFUJITSU LTD·Filed 2014·Granted Jan 10, 2017·0 cites·9 claims
- 1747US2016155089A1Component selection device and component selection methodFUJITSU LTD·Filed 2016·Application pending·0 cites
- 1845US2010124952A1Mobile terminal deviceFUJITSU LTD·Filed 2009·Application pending·0 cites
- 1944US7005318B2Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of timesFUJITSU LTD·Filed 2004·Granted Feb 28, 2006·0 cites·10 claims
- 2043US6465085B1Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the sameFUJITSU LTD·Filed 2000·Granted Oct 15, 2002·2 cites·20 claims
- 2143US6303877B2Multilayer thin-film wiring boardFUJITSU LTD·Filed 1998·Granted Oct 16, 2001·10 cites·4 claims
- 2241US2010246149A1Connection member and printed circuit board unitFUJITSU LTD·Filed 2010·Application pending·0 cites
- 2341US2011208484A1Design apparatus for electronic device, program for designing electronic device, and method of designing electronic deviceFUJITSU LTD·Filed 2011·Application pending·0 cites
- 2435US5496971ACircuit arrangement for multilayer printed circuit boardFUJITSU LTD·Filed 1994·Granted Mar 5, 1996·7 cites·3 claims
- 2535US2012095884A1Part information providing system, part information providing apparatus, and non-transitory computer-readable medium in which part information providing program is storedTANABE MISAKO·Filed 2011·Application pending·0 cites
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