Inventor · disambiguated record

Jai-Kyeong Shinn

Also filed as: SHINN JAI-KYEONG

1 granted patent·2 citations·filing 2006–2006

19Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0153US7486532B2Semiconductor multi-chip package including two semiconductor memory chips having different memory densitiesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 3, 2009·2 cites·25 claims

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