Inventor · disambiguated record
Satoru Yuhaku
Also filed as: YUHAKU SATORU
26 granted patents·2 pending applications·913 citations·filing 1984–2008
97Inventor score
Top patents by PatentIndex Score
28 records- 0198US6784530B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 31, 2004·169 cites·11 claims
- 0295US7018866B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·83 cites·15 claims
- 0394US4812422ADielectric paste and method of manufacturing the pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Mar 14, 1989·79 cites·3 claims
- 0486US4606750AMold for direct press molding of optical glass elementMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1984·Granted Aug 19, 1986·29 cites·6 claims
- 0580US4795512AMethod of manufacturing a multilayer ceramic bodyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1987·Granted Jan 3, 1989·41 cites·12 claims
- 0679US7875974B2Laminated mounting structure and memory cardPANASONIC CORP·Filed 2008·Granted Jan 25, 2011·13 cites·8 claims
- 0777US5547530AMethod of manufacturing a ceramic substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Aug 20, 1996·46 cites·26 claims
- 0875US5370759AMethod for producing multilayered ceramic substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Dec 6, 1994·57 cites·22 claims
- 0974US5014158ALaminated ceramic capacitorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted May 7, 1991·37 cites·5 claims
- 1072US5004640AMultilayered ceramic substrates and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Apr 2, 1991·39 cites·5 claims
- 1170US4695403AThick film conductor compositionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1986·Granted Sep 22, 1987·20 cites·13 claims
- 1269US4714570AConductor paste and method of manufacturing a multilayered ceramic body using the pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1985·Granted Dec 22, 1987·28 cites·6 claims
- 1367US5496619AAssembly formed from conductive paste and insulating pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 5, 1996·36 cites·4 claims
- 1466US5525402ACeramic substrate and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 11, 1996·27 cites·5 claims
- 1566US5503777AThixotropic conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Apr 2, 1996·30 cites·4 claims
- 1664US6207550B1Method for fabricating bump electrodes with a leveling step for uniform heightsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 27, 2001·30 cites·6 claims
- 1764US4877555AConductor composition and method of manufacturing a ceramic multilayer structure using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1988·Granted Oct 31, 1989·16 cites·3 claims
- 1864US4863683AConductor paste and method of manufacturing a multilayered ceramic body using the pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1987·Granted Sep 5, 1989·25 cites·35 claims
- 1959US5252519AMultilayered ceramic substrate and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Oct 12, 1993·29 cites·4 claims
- 2058US5688441AThixotropic conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 18, 1997·20 cites·7 claims
- 2157US7488895B2Method for manufacturing component built-in module, and component built-in modulePANASONIC CORP·Filed 2004·Granted Feb 10, 2009·8 cites·20 claims
- 2255US4906405AConductor composition and method of manufacturing a multilayered ceramic body using the compositionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1988·Granted Mar 6, 1990·14 cites·7 claims
- 2352US5407473AConductive inkMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Apr 18, 1995·19 cites·5 claims
- 2444US5662755AMethod of making multi-layered ceramic substratesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 2, 1997·12 cites·11 claims
- 2544US2009166839A1Semiconductor stack device and mounting methodPANASONIC CORP·Filed 2008·Application pending·0 cites
- 2639US6723251B2Method for planarizing circuit board and method for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 20, 2004·0 cites·7 claims
- 2738US6703262B2Method for planarizing circuit board and method for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 9, 2004·6 cites·15 claims
- 2837US2003127725A1Metal wiring board, semiconductor device, and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Application pending·0 cites
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