Inventor · disambiguated record
Minehiro Itagaki
Also filed as: ITAGAKI MINEHIRO
26 granted patents·768 citations·filing 1988–2004
97Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD26
Top patents by PatentIndex Score
26 records- 0195US6372548B2Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 16, 2002·170 cites·16 claims
- 0292US6229209B1Chip carrierMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted May 8, 2001·112 cites·35 claims
- 0386US6300576B1Printed-circuit board having projection electrodes and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 9, 2001·74 cites·18 claims
- 0485US6803639B2Photo-semiconductor module and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Oct 12, 2004·24 cites·15 claims
- 0584US6365499B1Chip carrier and method of manufacturing and mounting the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 2, 2002·29 cites·11 claims
- 0677US5547530AMethod of manufacturing a ceramic substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Aug 20, 1996·46 cites·26 claims
- 0775US6694613B2Method for producing a printed-circuit board having projection electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 24, 2004·18 cites·18 claims
- 0871US6372547B2Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 16, 2002·30 cites·8 claims
- 0967US5496619AAssembly formed from conductive paste and insulating pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 5, 1996·36 cites·4 claims
- 1066US5525402ACeramic substrate and manufacturing method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Jun 11, 1996·27 cites·5 claims
- 1166US5503777AThixotropic conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Apr 2, 1996·30 cites·4 claims
- 1265US6465082B1Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted bodyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 15, 2002·31 cites·27 claims
- 1364US6890789B2Photo-semiconductor module and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted May 10, 2005·7 cites·6 claims
- 1464US6376051B1Mounting structure for an electronic component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 23, 2002·4 cites·18 claims
- 1564US6207550B1Method for fabricating bump electrodes with a leveling step for uniform heightsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 27, 2001·30 cites·6 claims
- 1660US6468448B1Conductive composition, conductive adhesive, and their mounting structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 22, 2002·8 cites·34 claims
- 1758US5688441AThixotropic conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Nov 18, 1997·20 cites·7 claims
- 1857US6538315B2Semiconductor device and method of manufacturing sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 25, 2003·6 cites·20 claims
- 1956US6749889B2Method for producing mounting structure for an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 15, 2004·4 cites·9 claims
- 2055US4906405AConductor composition and method of manufacturing a multilayered ceramic body using the compositionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1988·Granted Mar 6, 1990·14 cites·7 claims
- 2153US6569512B2Mounting structure for an electronic component and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 27, 2003·3 cites·5 claims
- 2252US5407473AConductive inkMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Apr 18, 1995·19 cites·5 claims
- 2344US5662755AMethod of making multi-layered ceramic substratesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 2, 1997·12 cites·11 claims
- 2443US6488869B2Conductive paste, its manufacturing method, and printed wiring board using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Dec 3, 2002·8 cites·24 claims
- 2539US6723251B2Method for planarizing circuit board and method for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 20, 2004·0 cites·7 claims
- 2638US6703262B2Method for planarizing circuit board and method for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Mar 9, 2004·6 cites·15 claims
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