Inventor · disambiguated record
Michael F. Chisholm
Also filed as: CHISHOLM MICHAEL · CHISHOLM MICHAEL F · CHISHOLM MICHAEL FRANCIS
16 granted patents·1 pending application·607 citations·filing 1993–2021
95Inventor score
Top patents by PatentIndex Score
17 records- 0197US5536202ASemiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polishTEXAS INSTRUMENTS INC·Filed 1994·Granted Jul 16, 1996·172 cites·20 claims
- 0294US5522965ACompact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interfaceTEXAS INSTRUMENTS INC·Filed 1994·Granted Jun 4, 1996·99 cites·21 claims
- 0384US6077783AMethod and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor waferLSI LOGIC CORP·Filed 1998·Granted Jun 20, 2000·72 cites·10 claims
- 0478US5686356AConductor reticulation for improved device planarityTEXAS INSTRUMENTS INC·Filed 1994·Granted Nov 11, 1997·50 cites·18 claims
- 0577US6235590B1Fabrication of differential gate oxide thicknesses on a single integrated circuit chipLSI LOGIC CORP·Filed 1998·Granted May 22, 2001·49 cites·14 claims
- 0674US6586839B2Approach to structurally reinforcing the mechanical performance of silicon level interconnect layersTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 1, 2003·23 cites·9 claims
- 0772US5906754AApparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applicationsTEXAS INSTRUMENTS INC·Filed 1996·Granted May 25, 1999·41 cites·18 claims
- 0872US5595527AApplication of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polishTEXAS INSTRUMENTS INC·Filed 1995·Granted Jan 21, 1997·27 cites·20 claims
- 0968US5560802ASelective CMP of in-situ deposited multilayer films to enhance nonplanar step height reductionTEXAS INSTRUMENTS INC·Filed 1995·Granted Oct 1, 1996·36 cites·14 claims
- 1061US2021272842A1Transistor device with sinker contacts and methods for manufacturing the sameTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 1156US6495907B1Conductor reticulation for improved device planarityTEXAS INSTRUMENTS INC·Filed 1995·Granted Dec 17, 2002·16 cites·10 claims
- 1254US11037816B2Transistor device with sinker contacts and methods for manufacturing the sameTEXAS INSTRUMENTS INC·Filed 2017·Granted Jun 15, 2021·0 cites·17 claims
- 1351US9640953B2Switchgear motor operatorS & C ELECTRIC CO·Filed 2015·Granted May 2, 2017·1 cites·20 claims
- 1444US5755979AApplication of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polishTEXAS INSTRUMENTS INC·Filed 1996·Granted May 26, 1998·8 cites·10 claims
- 1538US6268224B1Method and apparatus for detecting an ion-implanted polishing endpoint layer within a semiconductor waferLSI LOGIC CORP·Filed 1998·Granted Jul 31, 2001·6 cites·15 claims
- 1634US5462882AMasked radiant anneal diffusion methodTEXAS INSTRUMENTS INC·Filed 1994·Granted Oct 31, 1995·4 cites·28 claims
- 1732US5420445AAluminum-masked and radiantly-annealed group II-IV diffused regionTEXAS INSTRUMENTS INC·Filed 1993·Granted May 30, 1995·3 cites·12 claims
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