Inventor · disambiguated record
Chen Xiong
Also filed as: XIONG CHEN
5 granted patents·3 citations·filing 2018–2022
65Inventor score
Top patents by PatentIndex Score
5 records- 0169US10340246B1Wire ball bonding in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 2, 2019·2 cites·20 claims
- 0267US12283559B2Copper wire bond on gold bump on semiconductor die bond padTEXAS INSTRUMENTS INC·Filed 2022·Granted Apr 22, 2025·0 cites·24 claims
- 0362US10692835B2Ball bond attachment for a semiconductor dieTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 23, 2020·1 cites·17 claims
- 0458US12108533B2Circuit board and method for manufacturing thereofAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 0554US11515275B2Copper wire bond on gold bump on semiconductor die bond padTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 29, 2022·0 cites·29 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →