Inventor · disambiguated record
Yuan-Lin Tzeng
Also filed as: TZENG YUAN-LIN
2 granted patents·1 pending application·24 citations·filing 2004–2007
56Inventor score
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3 records- 0172US7019389B2Lead frame and semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 28, 2006·23 cites·20 claims
- 0248US8207620B2Flip-chip semiconductor package and chip carrier for preventing corner delaminationTZENG YUAN-LIN·Filed 2007·Granted Jun 26, 2012·1 cites·10 claims
- 0343US2007262444A1Semiconductor device and chip structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →