Inventor · disambiguated record
Ming Hsien Chu
Also filed as: CHU MING HSIEN
4 granted patents·6 citations·filing 2018–2021
66Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG4
Top patents by PatentIndex Score
4 records- 0182US11037898B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·4 cites·16 claims
- 0280US11784152B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 10, 2023·1 cites·20 claims
- 0367US10763234B2Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layerADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 1, 2020·1 cites·15 claims
- 0461US11101237B2Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layerADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →