Inventor · disambiguated record
Jun Ohmori
Also filed as: OHMORI JUN · OHMORI JUN-YA
14 granted patents·1 pending application·497 citations·filing 1991–2002
94Inventor score
Top patents by PatentIndex Score
15 records- 0197USD369157SIC cardTOSHIBA KK·Filed 1995·Granted Apr 23, 1996·93 cites·1 claims
- 0296US6492718B2Stacked semiconductor device and semiconductor systemTOSHIBA KK·Filed 2000·Granted Dec 10, 2002·169 cites·19 claims
- 0389USD369156SIC CardTOSHIBA KK·Filed 1995·Granted Apr 23, 1996·36 cites·1 claims
- 0487US5547961AMethod of treatment of intestinal diseasesYAMANOUCHI PHARMA CO LTD·Filed 1995·Granted Aug 20, 1996·41 cites·6 claims
- 0579USD368903SIC moduleTOSHIBA KK·Filed 1995·Granted Apr 16, 1996·22 cites·1 claims
- 0678US6054774AThin type semiconductor packageTOSHIBA KK·Filed 1997·Granted Apr 25, 2000·55 cites·26 claims
- 0771US5780933ASubstrate for semiconductor device and semiconductor device using the sameTOSHIBA KK·Filed 1996·Granted Jul 14, 1998·42 cites·4 claims
- 0849US5336679ATetrahydroimidazopyridine derivatives and salts thereofYAMANOUCHI PHARMA CO LTD·Filed 1991·Granted Aug 9, 1994·3 cites·9 claims
- 0943US5956601AMethod of mounting a plurality of semiconductor devices in corresponding supportersTOSHIBA KK·Filed 1997·Granted Sep 21, 1999·16 cites·13 claims
- 1040US6022763ASubstrate for semiconductor device, semiconductor device using the same, and method for manufacture thereofTOSHIBA KK·Filed 1998·Granted Feb 8, 2000·10 cites·4 claims
- 1139US6711815B2Fabricating method of semiconductor devicesTOSHIBA KK·Filed 2002·Granted Mar 30, 2004·1 cites·9 claims
- 1238US6333212B1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2000·Granted Dec 25, 2001·0 cites·5 claims
- 1333US6462283B1Semiconductor package with central circuit patternTOSHIBA KK·Filed 1999·Granted Oct 8, 2002·6 cites·12 claims
- 1432US6166431ASemiconductor device with a thickness of 1 MM or lessTOKYO SHIBAURA ELECTRIC CO·Filed 1996·Granted Dec 26, 2000·3 cites·11 claims
- 1530US2001001507A1Substrate for a semiconductor device, a semiconductor device, a card type module, and a data memory deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1997·Application pending·0 cites
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