Inventor · disambiguated record
Jong-I Mou
Also filed as: MOU JONG-I
54 granted patents·1 pending application·275 citations·filing 2004–2015
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14TAIWAN SEMICONDUCTOR MFG10TSAI PO-FENG6HSU CHIH-WEI4TSEN ANDY4
Top patents by PatentIndex Score
55 records- 0194US8404572B2Multi-zone temperature control for semiconductor waferCHANG CHUN-LIN·Filed 2009·Granted Mar 26, 2013·40 cites·20 claims
- 0292US8295965B2Semiconductor processing dispatch controlWU SUNNY·Filed 2010·Granted Oct 23, 2012·15 cites·7 claims
- 0392US8229588B2Method and system for tuning advanced process control parametersTSEN ANDY·Filed 2009·Granted Jul 24, 2012·32 cites·17 claims
- 0492US8108060B2System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architectureTSEN ANDY·Filed 2009·Granted Jan 31, 2012·25 cites·19 claims
- 0590US10113233B2Multi-zone temperature control for semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 30, 2018·6 cites·14 claims
- 0689US9442392B2Scanner overlay correction system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 13, 2016·10 cites·20 claims
- 0789US8889434B2Scanner overlay correction system and methodTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 18, 2014·8 cites·12 claims
- 0888US10161965B2Method of test probe alignment controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·6 cites·20 claims
- 0988US9102033B2Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing processHUI KEUNG·Filed 2010·Granted Aug 11, 2015·11 cites·20 claims
- 1087US8309444B2System and method of dosage profile controlHUI KEUNG·Filed 2010·Granted Nov 13, 2012·8 cites·16 claims
- 1186US8627251B2Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processesCHEN JUI-LONG·Filed 2012·Granted Jan 7, 2014·7 cites·20 claims
- 1284US8606387B2Adaptive and automatic determination of system parametersTSAI PO-FENG·Filed 2011·Granted Dec 10, 2013·6 cites·20 claims
- 1384US8394719B2System and method for implementing multi-resolution advanced process controlTSEN ANDY·Filed 2011·Granted Mar 12, 2013·9 cites·20 claims
- 1483US9165843B2Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 20, 2015·3 cites·20 claims
- 1583US9158301B2Semiconductor processing dispatch controlTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 13, 2015·4 cites·20 claims
- 1682US10096482B2Apparatus and method for chemical mechanical polishing process controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 9, 2018·3 cites·20 claims
- 1782US8396583B2Method and system for implementing virtual metrology in semiconductor fabricationTSAI PO-FENG·Filed 2010·Granted Mar 12, 2013·6 cites·20 claims
- 1882US8205173B2Physical failure analysis guiding methodsWU SUNNY·Filed 2010·Granted Jun 19, 2012·7 cites·20 claims
- 1981US8041451B2Method for bin-based controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 18, 2011·9 cites·21 claims
- 2080US9023664B2Multi-zone temperature control for semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 5, 2015·3 cites·11 claims
- 2180US8082055B2Method for a bin ratio forecast at new tape out stageLIN CHUN-HSIEN·Filed 2009·Granted Dec 20, 2011·7 cites·20 claims
- 2279US9519285B2Systems and associated methods for tuning processing toolsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 13, 2016·4 cites·20 claims
- 2379US8938698B2Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 20, 2015·3 cites·19 claims
- 2478US9123583B2Overlay abnormality gating by Z dataTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 1, 2015·4 cites·20 claims
- 2575US8406904B2Two-dimensional multi-products multi-tools advanced process controlHSU CHIH-WEI·Filed 2011·Granted Mar 26, 2013·3 cites·20 claims
- 2674US8781614B2Semiconductor processing dispatch controlWU SUNNY·Filed 2012·Granted Jul 15, 2014·2 cites·18 claims
- 2773US8406912B2System and method for data mining and feature tracking for fab-wide prediction and controlCHEN JUI-LONG·Filed 2010·Granted Mar 26, 2013·3 cites·17 claims
- 2871US8452439B2Device performance parmeter tuning method and systemWU SUNNY·Filed 2011·Granted May 28, 2013·4 cites·13 claims
- 2970US9870896B2System and method for controlling ion implanterTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 16, 2018·2 cites·20 claims
- 3069US9349660B2Integrated circuit manufacturing tool condition monitoring system and methodTSAI PO-FENG·Filed 2011·Granted May 24, 2016·2 cites·20 claims
- 3168US9727049B2Qualitative fault detection and classification system for tool condition monitoring and associated methodsHO CHIA-TONG·Filed 2012·Granted Aug 8, 2017·3 cites·19 claims
- 3267US9000798B2Method of test probe alignment controlCHEN JUI-LONG·Filed 2012·Granted Apr 7, 2015·2 cites·20 claims
- 3367US8239056B2Advanced process control for new tapeout productHSU CHIH-WEI·Filed 2009·Granted Aug 7, 2012·2 cites·20 claims
- 3466US9466101B2Detection of defects on wafer during semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 11, 2016·3 cites·20 claims
- 3566US9141097B2Adaptive and automatic determination of system parametersTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·1 cites·20 claims
- 3666US7951615B2System and method for implementing multi-resolution advanced process controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 31, 2011·2 cites·20 claims
- 3765US8392009B2Advanced process control with novel sampling policyFEI WANG JO·Filed 2009·Granted Mar 5, 2013·4 cites·19 claims
- 3864US8219341B2System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) with routing modelTSEN ANDY·Filed 2009·Granted Jul 10, 2012·2 cites·14 claims
- 3963US9158867B22D/3D analysis for abnormal tools and stages diagnosisTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 13, 2015·1 cites·18 claims
- 4062US9250619B2Systems and methods of automatic boundary control for semiconductor processesHSU CHIH-WEI·Filed 2011·Granted Feb 2, 2016·1 cites·20 claims
- 4162US8549012B2Processing exception handlingTSAI PO-FENG·Filed 2010·Granted Oct 1, 2013·1 cites·18 claims
- 4258US8685759B2E-chuck with automated clamped force adjustment and calibrationWANG JO FEI·Filed 2010·Granted Apr 1, 2014·1 cites·20 claims
- 4358US7851233B2E-chuck for automated clamped force adjustment and calibrationTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Dec 14, 2010·0 cites·14 claims
- 4457US9082661B2Scanner overlay correction system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 14, 2015·0 cites·20 claims
- 4556US7977655B2Method and system of monitoring E-beam overlay and providing advanced process controlTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jul 12, 2011·0 cites·20 claims
- 4654US8925479B2System and method of dosage profile controlTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 6, 2015·0 cites·20 claims
- 4751US9698065B2Real-time calibration for wafer processing chamber lamp modulesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 4, 2017·0 cites·20 claims
- 4849US9159597B2Real-time calibration for wafer processing chamber lamp modulesCHANG CHIH-TIEN·Filed 2012·Granted Oct 13, 2015·0 cites·20 claims
- 4944US9477219B2Dynamic compensation in advanced process controlHSU CHIH-WEI·Filed 2010·Granted Oct 25, 2016·0 cites·20 claims
- 5042US10047439B2Method and system for tool condition monitoring based on a simulated inline measurementTSAI PO FENG·Filed 2011·Granted Aug 14, 2018·0 cites·20 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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