Inventor · disambiguated record
Chender Huang
Also filed as: HUANG CHENDER
29 granted patents·11 pending applications·1,675 citations·filing 1991–2009
98Inventor score
Top patents by PatentIndex Score
40 records- 0198US5214845AMethod for producing high speed integrated circuitsMICRON TECHNOLOGY INC·Filed 1992·Granted Jun 1, 1993·407 cites·4 claims
- 0296US6656827B1Electrical performance enhanced wafer level chip scale package with groundTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 2, 2003·142 cites·20 claims
- 0395US5302891ADiscrete die burn-in for non-packaged dieMICRON TECHNOLOGY INC·Filed 1992·Granted Apr 12, 1994·224 cites·43 claims
- 0494US7294937B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 13, 2007·26 cites·30 claims
- 0594US6770958B2Under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 3, 2004·80 cites·4 claims
- 0693US6091251ADiscrete die burn-in for nonpackaged dieFiled 1997·Granted Jul 18, 2000·125 cites·10 claims
- 0792US6939789B2Method of wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 6, 2005·84 cites·28 claims
- 0891US5322207AMethod and apparatus for wire bonding semiconductor dice to a leadframeMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jun 21, 1994·141 cites·15 claims
- 0989US6596619B1Method for fabricating an under bump metallization structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 22, 2003·48 cites·11 claims
- 1088US7157734B2Semiconductor bond pad structures and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 2, 2007·23 cites·20 claims
- 1188US6782897B2Method of protecting a passivation layer during solder bump formationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·52 cites·18 claims
- 1287US7190066B2Heat spreader and package structure utilizing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 13, 2007·14 cites·15 claims
- 1386US6372619B1Method for fabricating wafer level chip scale package with discrete package encapsulationTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 16, 2002·64 cites·15 claims
- 1485US7126225B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 24, 2006·29 cites·14 claims
- 1581US7026711B2Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA)TAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Apr 11, 2006·33 cites·15 claims
- 1679US5150194AAnti-bow zip lead frame designMICRON TECHNOLOGY INC·Filed 1991·Granted Sep 22, 1992·62 cites·1 claims
- 1770US6774026B1Structure and method for low-stress concentration solder bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 10, 2004·14 cites·8 claims
- 1869US6638837B1Method for protecting the front side of semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 28, 2003·12 cites·14 claims
- 1969US6528417B1Metal patterned structure for SiN surface adhesion enhancementTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 4, 2003·24 cites·36 claims
- 2068US6091250ADiscrete die burn-in for nonpackaged dieMICRON TECHNOLOGY INC·Filed 1994·Granted Jul 18, 2000·33 cites·13 claims
- 2167US7638887B2Package structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 29, 2009·3 cites·8 claims
- 2266US6960518B1Buildup substrate pad pre-solder bump manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 1, 2005·12 cites·6 claims
- 2365US7015066B2Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 21, 2006·11 cites·13 claims
- 2454US7443010B2Matrix form semiconductor package substrate having an electrode of serpentine shapeTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 28, 2008·6 cites·17 claims
- 2550US7378731B2Heat spreader and package structure utilizing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 27, 2008·0 cites·11 claims
- 2649US8685834B2Fabrication method of package structure with simplified encapsulation structure and simplified wiringTSAO PEI-HAW·Filed 2009·Granted Apr 1, 2014·0 cites·10 claims
- 2749US6998860B1Method for burn-in testing semiconductor diceMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 14, 2006·4 cites·4 claims
- 2847US7390697B2Enhanced adhesion strength between mold resin and polyimideTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 24, 2008·0 cites·14 claims
- 2947US6884662B1Enhanced adhesion strength between mold resin and polyimideTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 26, 2005·2 cites·17 claims
- 3042US2007238283A1Novel under-bump metallization for bond pad solderingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3141US2006231960A1Non-cavity semiconductor packagesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3241US2006278975A1Ball grid array package with thermally-enhanced heat spreaderTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3340US2004217482A1Structure and method for low-stress concentration solder bumpsFiled 2004·Application pending·0 cites
- 3439US2006076681A1Semiconductor package substrate for flip chip packagingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3539US2006060980A1Ic package having ground ic chip and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 3638US2006043556A1Stacked packaging methods and structuresSU CHAO-YUAN·Filed 2004·Application pending·0 cites
- 3738US2006073635A1Three dimensional package type stacking for thinner package applicationSU CHAO-YUAN·Filed 2004·Application pending·0 cites
- 3837US2006109014A1Test pad and probe card for wafer acceptance testing and other applicationsCHAO TE-TSUNG·Filed 2004·Application pending·0 cites
- 3937US2006091535A1Fine pitch bonding pad layout and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 4034US2006065958A1Three dimensional package and packaging method for integrated circuitsTSAO PEI-HAW·Filed 2004·Application pending·0 cites
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