Inventor · disambiguated record
Erick G. Walton
Also filed as: WALTON ERICK G · WALTON ERICK GREGORY
27 granted patents·2 pending applications·1,722 citations·filing 1985–2009
98Inventor score
Top patents by PatentIndex Score
29 records- 0197US5134460AAluminum bump, reworkable bump, and titanium nitride structure for tab bondingIBM·Filed 1990·Granted Jul 28, 1992·265 cites·15 claims
- 0294US6110832AMethod and apparatus for slurry polishingIBM·Filed 1999·Granted Aug 29, 2000·157 cites·18 claims
- 0394US5130779ASolder mass having conductive encapsulating arrangementIBM·Filed 1990·Granted Jul 14, 1992·185 cites·47 claims
- 0493US4840302AChromium-titanium alloyIBM·Filed 1988·Granted Jun 20, 1989·86 cites·15 claims
- 0592US5251806AMethod of forming dual height solder interconnectionsIBM·Filed 1992·Granted Oct 12, 1993·144 cites·48 claims
- 0690US6270646B1Electroplating apparatus and method using a compressible contactIBM·Filed 1999·Granted Aug 7, 2001·82 cites·22 claims
- 0789US6471845B1Method of controlling chemical bath composition in a manufacturing environmentIBM·Filed 1999·Granted Oct 29, 2002·63 cites·11 claims
- 0889US5876266APolishing pad with controlled release of desired micro-encapsulated polishing agentsIBM·Filed 1997·Granted Mar 2, 1999·84 cites·33 claims
- 0988US6605534B1Selective deposition of a conductive materialIBM·Filed 2000·Granted Aug 12, 2003·57 cites·12 claims
- 1086US6409903B1Multi-step potentiostatic/galvanostatic plating controlIBM·Filed 1999·Granted Jun 25, 2002·59 cites·18 claims
- 1185US4723978AMethod for a plasma-treated polysiloxane coatingIBM·Filed 1985·Granted Feb 9, 1988·73 cites·10 claims
- 1282US7015580B2Roughened bonding pad and bonding wire surfaces for low pressure wire bondingIBM·Filed 2003·Granted Mar 21, 2006·30 cites·13 claims
- 1382US5766971AOxide strip that improves planarityIBM·Filed 1996·Granted Jun 16, 1998·67 cites·26 claims
- 1481US7207096B2Method of manufacturing high performance copper inductors with bond padsIBM·Filed 2004·Granted Apr 24, 2007·23 cites·4 claims
- 1581US5997392ASlurry injection technique for chemical-mechanical polishingIBM·Filed 1997·Granted Dec 7, 1999·58 cites·25 claims
- 1680US5420455AArray fuse damage protection devices and fabrication methodIBM·Filed 1994·Granted May 30, 1995·49 cites·5 claims
- 1778US4606998ABarrierless high-temperature lift-off processIBM·Filed 1985·Granted Aug 19, 1986·53 cites·21 claims
- 1877US5760674AFusible links with improved interconnect structureIBM·Filed 1995·Granted Jun 2, 1998·45 cites·20 claims
- 1975US4981530APlanarizing ladder-type silsesquioxane polymer insulation layerIBM·Filed 1988·Granted Jan 1, 1991·43 cites·14 claims
- 2068US5523253AArray protection devices and fabrication methodIBM·Filed 1995·Granted Jun 4, 1996·28 cites·2 claims
- 2161US5877589AGas discharge devices including matrix materials with ionizable gas filled sealed cavitiesIBM·Filed 1997·Granted Mar 2, 1999·14 cites·24 claims
- 2258US5286572APlanarizing ladder-type silsequioxane polymer insulation layerIBM·Filed 1992·Granted Feb 15, 1994·18 cites·15 claims
- 2357US7678258B2Void-free damascene copper deposition process and means of monitoring thereofIBM·Filed 2003·Granted Mar 16, 2010·1 cites·11 claims
- 2457US6054339AFusible links formed on interconnects which are at least twice as long as they are deepIBM·Filed 1997·Granted Apr 25, 2000·19 cites·17 claims
- 2555US2010051474A1Method and composition for electro-chemical-mechanical polishingANDRICACOS PANAYOTIS C·Filed 2009·Application pending·0 cites
- 2651US7052925B2Method for manufacturing self-compensating resistors within an integrated circuitIBM·Filed 2004·Granted May 30, 2006·4 cites·8 claims
- 2751US5723898AArray protection devices and methodIBM·Filed 1996·Granted Mar 3, 1998·14 cites·2 claims
- 2847US2006163083A1Method and composition for electro-chemical-mechanical polishingIBM·Filed 2005·Application pending·0 cites
- 2944US7227265B2Electroplated copper interconnection structure, process for making and electroplating bathIBM·Filed 2004·Granted Jun 5, 2007·1 cites·21 claims
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