Inventor · disambiguated record
Karl J. Puttlitz
Also filed as: PUTTLITZ KARL J · PUTTLITZ KARL JOSEPH · PUTTLITZ SR KARL J
21 granted patents·1,286 citations·filing 1977–2004
97Inventor score
Files withIBM21
Top patents by PatentIndex Score
21 records- 0196US4604644ASolder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for makingIBM·Filed 1985·Granted Aug 5, 1986·396 cites·15 claims
- 0294US5130779ASolder mass having conductive encapsulating arrangementIBM·Filed 1990·Granted Jul 14, 1992·185 cites·47 claims
- 0393US6805974B2Lead-free tin-silver-copper alloy solder compositionIBM·Filed 2002·Granted Oct 19, 2004·59 cites·73 claims
- 0492US5251806AMethod of forming dual height solder interconnectionsIBM·Filed 1992·Granted Oct 12, 1993·144 cites·48 claims
- 0589US6212070B1Zero force heat sinkIBM·Filed 1998·Granted Apr 3, 2001·106 cites·40 claims
- 0687US6287126B1Mechanical attachment means used as electrical connectionIBM·Filed 1999·Granted Sep 11, 2001·58 cites·48 claims
- 0777US5862588AMethod for restraining circuit board warp during area array reworkIBM·Filed 1995·Granted Jan 26, 1999·45 cites·6 claims
- 0875US6179196B1Apparatus for manufacturing circuit boardsIBM·Filed 2000·Granted Jan 30, 2001·19 cites·20 claims
- 0974US5458281AMethod for removing meltable material from a substrateIBM·Filed 1994·Granted Oct 17, 1995·25 cites·3 claims
- 1074US5284286APorous metal block for removing solder or braze from a substate and a process for making the sameIBM·Filed 1991·Granted Feb 8, 1994·31 cites·9 claims
- 1173US5721299AElectrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereofIBM·Filed 1994·Granted Feb 24, 1998·46 cites·24 claims
- 1268US5805430AZero force heat sinkIBM·Filed 1996·Granted Sep 8, 1998·33 cites·5 claims
- 1367US5219520AProcess of making a porous metal block for removing solder or brazeIBM·Filed 1992·Granted Jun 15, 1993·24 cites·28 claims
- 1462US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 1562US6746770B1Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereofIBM·Filed 1995·Granted Jun 8, 2004·30 cites·60 claims
- 1662US5620132AApparatus and method for removing meltable material from a substrateIBM·Filed 1995·Granted Apr 15, 1997·18 cites·24 claims
- 1758US6703560B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2001·Granted Mar 9, 2004·7 cites·7 claims
- 1852US5868304ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1996·Granted Feb 9, 1999·19 cites·9 claims
- 1952US4160893AIndividual chip joining machineIBM·Filed 1977·Granted Jul 10, 1979·18 cites·14 claims
- 2047US6068175ASystem for replacing a first area array component connected to an interconnect boardIBM·Filed 1998·Granted May 30, 2000·11 cites·20 claims
- 2132US6070782ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1998·Granted Jun 6, 2000·3 cites·5 claims
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