Inventor · disambiguated record
Atsushi Nishikizawa
Also filed as: NISHIKIZAWA ATSUSHI
21 granted patents·109 citations·filing 1995–2018
94Inventor score
Top patents by PatentIndex Score
21 records- 0191US8367479B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 5, 2013·13 cites·10 claims
- 0282US9735127B2Semiconductor device and electronic deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·3 cites·20 claims
- 0381US7462887B2Semiconductor connection componentRENESAS TECH CORP·Filed 2006·Granted Dec 9, 2008·8 cites·7 claims
- 0478US8994159B2Semiconductor device and manufacturing method thereofNAKAMURA HIROYUKI·Filed 2013·Granted Mar 31, 2015·4 cites·28 claims
- 0578US5808359ASemiconductor device having a heat sink with bumpers for protecting outer leadsHITACHI LTD·Filed 1995·Granted Sep 15, 1998·40 cites·6 claims
- 0673US10522446B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 31, 2019·2 cites·9 claims
- 0773US8338927B2Semiconductor device with the leads projected from sealing bodyNAKAMURA HIROYUKI·Filed 2011·Granted Dec 25, 2012·3 cites·20 claims
- 0871US6492739B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2002·Granted Dec 10, 2002·12 cites·7 claims
- 0969US10347567B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·10 claims
- 1066US7968370B2Semiconductor connection componentRENESAS ELECTRONICS CORP·Filed 2008·Granted Jun 28, 2011·2 cites·7 claims
- 1164US10037932B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 31, 2018·1 cites·10 claims
- 1262US6320270B1Semiconductor device and method of producing the sameHITACHI LTD·Filed 2000·Granted Nov 20, 2001·7 cites·4 claims
- 1355US6392308B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2001·Granted May 21, 2002·4 cites·6 claims
- 1453US8026130B2Method for manufacturing a semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 27, 2011·0 cites·20 claims
- 1550US10157878B2Semiconductor device and electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 18, 2018·0 cites·10 claims
- 1650US10083898B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Sep 25, 2018·0 cites·8 claims
- 1749US9837339B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 5, 2017·0 cites·12 claims
- 1848US8298859B2Semiconductor connection componentKOIKE NOBUYA·Filed 2011·Granted Oct 30, 2012·0 cites·4 claims
- 1946US6104085ASemiconductor device and method of producing the sameHITACHI LTD·Filed 1999·Granted Aug 15, 2000·9 cites·11 claims
- 2041US10643930B2Semiconductor device with semiconductor chips of different sizes and manufacturing method threreofRENESAS ELECTRONICS CORP·Filed 2017·Granted May 5, 2020·0 cites·8 claims
- 2134US9530721B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·10 claims
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