Inventor · disambiguated record
Nicholas G. Koopman
Also filed as: KOOPMAN NICHOLAS G · KOOPMAN NICHOLAS GEORGE
20 granted patents·1,251 citations·filing 1976–1996
97Inventor score
Top patents by PatentIndex Score
20 records- 0195US5289631AMethod for testing, burn-in, and/or programming of integrated circuit chipsMCNC·Filed 1992·Granted Mar 1, 1994·222 cites·9 claims
- 0295US4034468AMethod for making conduction-cooled circuit packageIBM·Filed 1976·Granted Jul 12, 1977·97 cites·19 claims
- 0394US5130779ASolder mass having conductive encapsulating arrangementIBM·Filed 1990·Granted Jul 14, 1992·185 cites·47 claims
- 0492US5251806AMethod of forming dual height solder interconnectionsIBM·Filed 1992·Granted Oct 12, 1993·144 cites·48 claims
- 0590US4081825AConduction-cooled circuit packageIBM·Filed 1977·Granted Mar 28, 1978·52 cites·16 claims
- 0686US4034469AMethod of making conduction-cooled circuit packageIBM·Filed 1976·Granted Jul 12, 1977·44 cites·16 claims
- 0785US5447264ARecessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereonMCNC·Filed 1994·Granted Sep 5, 1995·79 cites·26 claims
- 0885US4463059ALayered metal film structures for LSI chip carriers adapted for solder bonding and wire bondingIBM·Filed 1982·Granted Jul 31, 1984·60 cites·11 claims
- 0983US5499754AFluxless soldering sample pretreating systemMCNC·Filed 1994·Granted Mar 19, 1996·44 cites·22 claims
- 1082US5381946AMethod of forming differing volume solder bumpsMCNC·Filed 1993·Granted Jan 17, 1995·60 cites·8 claims
- 1180US5407121AFluxless soldering of copperMCNC·Filed 1993·Granted Apr 18, 1995·44 cites·23 claims
- 1273US4434434ASolder mound formation on substratesIBM·Filed 1981·Granted Feb 28, 1984·41 cites·12 claims
- 1371US5048744APalladium enhanced fluxless soldering and bonding of semiconductor device contactsIBM·Filed 1990·Granted Sep 17, 1991·47 cites·19 claims
- 1467US5992729ATacking processes and systems for solderingMCNC·Filed 1996·Granted Nov 30, 1999·25 cites·27 claims
- 1567US5315485AVariable size capture pads for multilayer ceramic substrates and connectors thereforMCNC·Filed 1992·Granted May 24, 1994·33 cites·36 claims
- 1663US5374893AApparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereonMCNC·Filed 1993·Granted Dec 20, 1994·28 cites·11 claims
- 1746US4332343AProcess for in-situ modification of solder comopsitionIBM·Filed 1980·Granted Jun 1, 1982·16 cites·6 claims
- 1845US5412537AElectrical connector including variably spaced connector contactsMCNC·Filed 1994·Granted May 2, 1995·12 cites·21 claims
- 1943US5225711APalladium enhanced soldering and bonding of semiconductor device contactsIBM·Filed 1991·Granted Jul 6, 1993·13 cites·9 claims
- 2037US4492842AProcess of brazing using low temperature braze alloy of gold-indium tinIBM·Filed 1983·Granted Jan 8, 1985·5 cites·7 claims
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