Inventor · disambiguated record
Bainye Francoise Angoua
Also filed as: ANGOUA BAINYE · Angoua Bainye Francoise
2 granted patents·9 pending applications·1 citations·filing 2016–2024
31Inventor score
Top patents by PatentIndex Score
11 records- 0177US12442979B2Optical waveguide formed within in a glass layerINTEL CORP·Filed 2021·Granted Oct 14, 2025·1 cites·25 claims
- 0259US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0353US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0451US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 0550US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0646US2023207503A1Stress arrest lip on copper pad for low roughness copperINTEL CORP·Filed 2021·Application pending·0 cites
- 0743US2023187331A1Interposer with a glass core that includes openings and through glass viasINTEL CORP·Filed 2021·Application pending·0 cites
- 0842US2023086881A1Double-sided glass substrate with a hybrid bonded photonic integrated circuitINTEL CORP·Filed 2021·Application pending·0 cites
- 0942US2024203664A1In core large area capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 1041US2024153857A1High aspect ratio tgv substrates through direct hybrid bonding of thin tgv substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1140US9799593B1Semiconductor package substrate having an interfacial layerINTEL CORP·Filed 2016·Granted Oct 24, 2017·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →