Inventor · disambiguated record

Wei-Tsui Tseng

Also filed as: TSENG WEI-TSUI

1 granted patent·3 citations·filing 2008–2008

21Inventor score

Technology areasH10W

Files withIBM1

Top patents by PatentIndex Score

1 record

0164US8026166B2Interconnect structures comprising capping layers with low dielectric constants and methods of making the sameIBM·Filed 2008·Granted Sep 27, 2011·3 cites·7 claims

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