Inventor · disambiguated record
Yi Shi
Also filed as: SHI YI · SHI YI C · SHI YI-YU
13 granted patents·23 pending applications·53 citations·filing 1998–2024
85Inventor score
Files withINTEL CORP15NANJING UNIVERSITY OF TECHNOLOGY9HENKEL AG & CO KGAA3NANJING UNIVERSITY2AGENCY SCIENCE TECH & RES1
Top patents by PatentIndex Score
36 records- 0182US11339501B2Method for preparing large-area transition metal dichalcogenide single-crystal films by performing vapor deposition on a single-crystal c-plane sapphire substrate with <10-10> surface stepsNANJING UNIVERSITY OF TECHNOLOGY·Filed 2020·Granted May 24, 2022·1 cites·4 claims
- 0278US8604409B2Photosensitive detector with composite dielectric gate MOSFET structure and its signal readout methodYAN FENG·Filed 2010·Granted Dec 10, 2013·5 cites·14 claims
- 0373US6001709AModified LOCOS isolation process for semiconductor devicesNANYA TECHNOLOGY CORP·Filed 1998·Granted Dec 14, 1999·45 cites·10 claims
- 0469US12385140B2Method for uniform growth of bi-layer transition metal dichalcogenide continuous filmsNANJING UNIVERSITY·Filed 2022·Granted Aug 12, 2025·0 cites·4 claims
- 0559US2025112187A1Ic assemblies with self-alignment structures having zero misalignmentINTEL CORP·Filed 2023·Application pending·0 cites
- 0659US2025210392A1Handling assembly, handling system and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 0758US2024105821A1Structure of two-dimensional material-based device having air-gap and method for preparing sameNANJING UNIVERSITY OF TECHNOLOGY·Filed 2023·Application pending·0 cites
- 0858US2025112200A1Hybrid bonding of thin die structures by self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 0958US2025112199A1Self-alignment assisted assembly of multi-level die complexesINTEL CORP·Filed 2023·Application pending·0 cites
- 1058US2025112181A1Bonding structures having non-vertical edges for self-alignment assisted assembly of integrated circuit die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 1158US2025112173A1Pre-assembly warpage compensation of thin die structuresINTEL CORP·Filed 2023·Application pending·0 cites
- 1258US2025112177A1Self-alignment assisted assembly on a structural wafer for hybrid bonded die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 1357US2024272207A1AC Current Sensor And Wireless Charging ChipNANJING UNIVERSITY·Filed 2023·Application pending·0 cites
- 1456US2025192096A1Self-assembly method and equipmentINTEL CORP·Filed 2023·Application pending·0 cites
- 1555US2025112185A1Superhydrophobic surfaces for liquid containment in self-alignment assisted assembly of integrated circuit die stacksINTEL CORP·Filed 2023·Application pending·0 cites
- 1655US2024429199A1Methods and apparatus for self-aligning batch pick and place die bondingINTEL CORP·Filed 2023·Application pending·0 cites
- 1751US2023197520A1Dummy die placement within a dicing street of a waferINTEL CORP·Filed 2021·Application pending·0 cites
- 1851US2024347501A1Methods and apparatus for die-shape modification bondingNIAZI HARIS KHAN·Filed 2024·Application pending·0 cites
- 1951US2024063136A1Integrated circuit device with electrically active fiducialsINTEL CORP·Filed 2022·Application pending·0 cites
- 2048US2024006358A1Substrate trench for improved hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 2148US2024063142A1Die crack mitigation in multi-chip composite ic structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2247US9276254B2Method for removing burrs of battery electrode plates by inductively coupled plasma dry etchingNANJING UNIVERSITY OF TECHNOLOGY·Filed 2013·Granted Mar 1, 2016·0 cites·2 claims
- 2347US2024006332A1Fiducial marks for verifying alignment accuracy of bonded integrated circuit diesINTEL CORP·Filed 2022·Application pending·0 cites
- 2445US7586202B2Alignment sensing method for semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2002·Granted Sep 8, 2009·2 cites·2 claims
- 2545US2018298520A1Self-limited organic molecular beam epitaxy for precisely growing ultrathin C8-BTBT, PTCDA and their heterojunctions on surfaceNANJING UNIVERSITY OF TECHNOLOGY·Filed 2017·Application pending·0 cites
- 2642US2020181799A1Method for Preparing GaN Substrate MaterialNANJING UNIVERSITY OF TECHNOLOGY·Filed 2018·Application pending·0 cites
- 2742US2023255547A1Method for determining a scalp type of a userHENKEL AG & CO KGAA·Filed 2020·Application pending·0 cites
- 2841US11688826B2Light emitting device, method of fabricating same and method of controlling light emissionAGENCY SCIENCE TECH & RES·Filed 2018·Granted Jun 27, 2023·0 cites·19 claims
- 2941US10716746B2Sprayable gel composition and use thereofHENKEL AG & CO KGAA·Filed 2015·Granted Jul 21, 2020·0 cites·20 claims
- 3040US11102438B22×2 array arrangement based on composite dielectric gate photosensitive detector and operating method thereofNANJING UNIVERSITY OF TECHNOLOGY·Filed 2018·Granted Aug 24, 2021·0 cites·6 claims
- 3139US10736835B2Sprayable gel composition for hair conditioningHENKEL AG & CO KGAA·Filed 2015·Granted Aug 11, 2020·0 cites·16 claims
- 3238US11342367B2Photosensitive detector, imaging sensor chip formed using the photosentive detector, and detection methodNANJING UNIVERSITY OF TECHNOLOGY·Filed 2018·Granted May 24, 2022·0 cites·10 claims
- 3338US8867254B2Flexible memory and its fabrication processNANJING UNIVERSITY OF TECHNOLOGY·Filed 2013·Granted Oct 21, 2014·0 cites·4 claims
- 3435US9275771B2Conductive polymer, synthesis method thereof, and electroactive electrode covered with said conductive polymerPAN LIJIA·Filed 2011·Granted Mar 1, 2016·0 cites·11 claims
- 3535US2010288190A1Growth Method of Non-Polarized-Plane InNNANJING UNIVERSITY OF TECHNOLOGY·Filed 2010·Application pending·0 cites
- 3625US2006034498A1Fingerprint identification data accessing deviceCHANG SHI S·Filed 2005·Application pending·0 cites
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