Inventor · disambiguated record

John Robert Diroll

Also filed as: DIROLL JOHN ROBERT

2 granted patents·14 citations·filing 2006–2010

57Inventor score

Technology areasH10W

Files withFAIRCHILD SEMICONDUCTOR1 YILMAZ HAMZA1

Top patents by PatentIndex Score

2 records

0184US7768075B2Semiconductor die packages using thin dies and metal substratesFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Aug 3, 2010·12 cites·9 claims
0267US8329508B2Semiconductor die packages using thin dies and metal substratesYILMAZ HAMZA·Filed 2010·Granted Dec 11, 2012·2 cites·22 claims

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