Inventor · disambiguated record
Mitsuyoshi Nishino
Also filed as: NISHINO MITSUYOSHI
6 granted patents·5 pending applications·3 citations·filing 2008–2022
68Inventor score
Top patents by PatentIndex Score
11 records- 0172US10017601B2Resin composition, prepreg and laminate boardPANASONIC IP MAN CO LTD·Filed 2014·Granted Jul 10, 2018·1 cites·10 claims
- 0260US8603624B2Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mountingMATSUDA TAKASHI·Filed 2010·Granted Dec 10, 2013·2 cites·8 claims
- 0356US2024182614A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0455US2011250459A1Epoxy resin composition, prepreg, laminate board, and multi-layer boardNISHINO MITSUYOSHI·Filed 2009·Application pending·0 cites
- 0550US9775239B2Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·13 claims
- 0649US12447719B2Metal-clad laminate, wiring board, resin-including metal foil, and resin compositionPANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 21, 2025·0 cites·18 claims
- 0749US9730320B2Prepreg, laminate, metal foil-clad laminate, circuit board and LED moduleMATSUDA TAKASHI·Filed 2011·Granted Aug 8, 2017·0 cites·6 claims
- 0847US9718941B2Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit boardMATSUDA TAKASHI·Filed 2012·Granted Aug 1, 2017·0 cites·10 claims
- 0945US2010096173A1Epoxy resin composition, prepreg, and laminate and printed wiring boardFUJINO KENTARO·Filed 2008·Application pending·0 cites
- 1039US2021395452A1Metal-clad laminate, wiring board, metal foil provided with resin, and resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 1139US2024182657A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →