Inventor · disambiguated record
Tatsuya Arisawa
Also filed as: ARISAWA TATSUYA
9 granted patents·2 pending applications·0 citations·filing 2015–2022
73Inventor score
Files withPANASONIC IP MAN CO LTD11
Top patents by PatentIndex Score
11 records- 0163US2024279434A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0254US12109779B2Copper-clad laminate, wiring board, and copper foil with resinPANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 8, 2024·0 cites·12 claims
- 0352US10820413B2Metal-clad laminate, metal member with resin, and wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 27, 2020·0 cites·8 claims
- 0451US11312858B2Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 26, 2022·0 cites·10 claims
- 0550US11267225B2Metal-clad laminated board, method for producing metal-clad laminated board, resin-attached metal member, method for producing resin-attached metal member, wiring board and method for producing wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Mar 8, 2022·0 cites·15 claims
- 0650US9775239B2Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·13 claims
- 0749US12447719B2Metal-clad laminate, wiring board, resin-including metal foil, and resin compositionPANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 21, 2025·0 cites·18 claims
- 0848US11895770B2Copper-clad laminate, wiring board, and copper foil provided with resinPANASONIC IP MAN CO LTD·Filed 2019·Granted Feb 6, 2024·0 cites·7 claims
- 0948US11330710B2Metal-clad laminated board, metal member provided with resin, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted May 10, 2022·0 cites·9 claims
- 1045US11078361B2Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 3, 2021·0 cites·12 claims
- 1139US2021395452A1Metal-clad laminate, wiring board, metal foil provided with resin, and resin compositionPANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →