Inventor · disambiguated record
Bei Tong
Also filed as: Tong bei
7 granted patents·1 pending application·0 citations·filing 2016–2024
67Inventor score
Files withAAC ACOUSTIC TECH SHENZHEN CO LTD2AAC KAITAI TECH WUHAN CO LTD2WUHAN NEURACOM TECH DEVELOPMENT CO LTD2HUAWEI CLOUD COMPUTING TECH CO LTD1Tong bei1
Top patents by PatentIndex Score
8 records- 0161US12311138B2Area array micro-needle structureWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Granted May 27, 2025·0 cites·7 claims
- 0260US12390163B2Composite microneedle structure based on integrated circuit chipWUHAN NEURACOM TECH DEVELOPMENT CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·7 claims
- 0355US2024202535A1Model training method, system, cluster, and mediumHUAWEI CLOUD COMPUTING TECH CO LTD·Filed 2024·Application pending·0 cites
- 0453US11863934B2MEMS microphoneAAC KAITAI TECH WUHAN CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 0553US11159895B2Piezoelectric type and capacitive type combined MEMS microphoneAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2020·Granted Oct 26, 2021·0 cites·20 claims
- 0652US11310606B2MEMS microphoneAAC ACOUSTIC TECH SHENZHEN CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·8 claims
- 0750US12448276B2MEMS microphone including a cross beam assemblyAAC KAITAI TECH WUHAN CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·9 claims
- 0842US10605788B2Saw magnetic sensor and manufacturing method for sameTong bei·Filed 2016·Granted Mar 31, 2020·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →