Inventor · disambiguated record
Ding-Yuan S. Day
Also filed as: DAY DING Y S · DAY DING-YUAN · DAY DING-YUAN S
5 granted patents·540 citations·filing 1988–1993
87Inventor score
Files withAVANTEK5
Top patents by PatentIndex Score
5 records- 0194US4978639AMethod for the simultaneous formation of via-holes and wraparound plating on semiconductor chipsAVANTEK·Filed 1989·Granted Dec 18, 1990·177 cites·8 claims
- 0294US4842699AMethod of selective via-hole and heat sink plating using a metal maskAVANTEK·Filed 1988·Granted Jun 27, 1989·145 cites·12 claims
- 0392US4808273AMethod of forming completely metallized via holes in semiconductorsAVANTEK·Filed 1988·Granted Feb 28, 1989·117 cites·17 claims
- 0471US5288660AMethod for forming self-aligned t-shaped transistor electrodeAVANTEK·Filed 1993·Granted Feb 22, 1994·50 cites·17 claims
- 0570US5127984ARapid wafer thinning processAVANTEK·Filed 1991·Granted Jul 7, 1992·51 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →