Inventor · disambiguated record
Chun-Kuang Chen
Also filed as: CHEN CHUN-KUANG
106 granted patents·26 pending applications·467 citations·filing 2002–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD69TAIWAN SEMICONDUCTOR MFG21LEXTAR ELECTRONICS CORP20CHEN CHUN-KUANG6GOOEE LTD4
Top patents by PatentIndex Score
132 records- 0198US11862623B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 2, 2024·3 cites·20 claims
- 0296US9793211B2Dual power structure with connection pinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·13 cites·20 claims
- 0396US9418868B1Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·11 cites·20 claims
- 0496US7091502B2Apparatus and method for immersion lithographyTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 15, 2006·72 cites·23 claims
- 0594US10177133B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 8, 2019·8 cites·20 claims
- 0694US9431297B2Method of forming an interconnect structure for a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·15 cites·20 claims
- 0793US11581300B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·2 cites·20 claims
- 0893US9911697B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·8 cites·20 claims
- 0991US6914525B2Alert system and method for geographic or natural disasters utilizing a telecommunications networkFAR EASTONE TELECOMM CO LTD·Filed 2002·Granted Jul 5, 2005·122 cites·29 claims
- 1090US10880981B2Collector pellicleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·4 cites·20 claims
- 1190US8227150B2Holographic reticle and patterning methodCHANG SHIH-MING·Filed 2010·Granted Jul 24, 2012·6 cites·20 claims
- 1289US9991132B2Lithographic technique incorporating varied pattern materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 5, 2018·5 cites·20 claims
- 1389US9449880B1Fin patterning methods for increased process marginTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·6 cites·20 claims
- 1489US2025318271A1Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1588US10510688B2Via rail solution for high power electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·4 cites·20 claims
- 1688US10276499B2Dual power structure with connection pinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·4 cites·20 claims
- 1788US10170422B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 1, 2019·4 cites·20 claims
- 1888US10096522B2Dummy MOL removal for performance enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 9, 2018·4 cites·20 claims
- 1988US10007177B2Method to define multiple layer patterns using double exposuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 26, 2018·4 cites·20 claims
- 2088US9984876B2Lithographic technique for feature cut by line-end shrinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·3 cites·20 claims
- 2188US8741552B2Double patterning strategy for contact hole and trench in photolithographyCHEN CHUN-KUANG·Filed 2010·Granted Jun 3, 2014·9 cites·21 claims
- 2287US12394633B2Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 2387US10366973B2Layout modification method for exposure manufacturing processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 30, 2019·2 cites·20 claims
- 2487US10203606B1Apparatus and method for dispensing developer onto semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 12, 2019·3 cites·20 claims
- 2587US10163654B2Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·3 cites·8 claims
- 2687US9814111B1Modular light control device and dimming control systemGOOEE LTD·Filed 2016·Granted Nov 7, 2017·6 cites·14 claims
- 2787US7935477B2Double patterning strategy for contact hole and trenchTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 3, 2011·12 cites·18 claims
- 2886US12336296B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2986US10642158B2Method of controlling reticle masking blade positioning to minimize impact on critical dimension uniformity and device for controlling reticle masking blade positioningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·2 cites·20 claims
- 3086US9684236B1Method of patterning a film layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 20, 2017·4 cites·20 claims
- 3186US9613850B2Lithographic technique for feature cut by line-end shrinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·3 cites·20 claims
- 3286US9210778B2Integrated wireless and wired light control systemLEXTAR ELECTRONICS CORP·Filed 2014·Granted Dec 8, 2015·10 cites·21 claims
- 3385US10388523B2Lithographic technique for feature cut by line-end shrinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 20, 2019·2 cites·20 claims
- 3484US12347682B2Using cumulative heat amount data to qualify hot plate used for post-exposure bakingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 3584US10833061B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 10, 2020·2 cites·20 claims
- 3684US10169515B2Layout modification method and systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 1, 2019·4 cites·20 claims
- 3784US9997404B2Method of forming an interconnect structure for a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·3 cites·20 claims
- 3884US7732109B2Method and system for improving critical dimension uniformityTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 8, 2010·6 cites·21 claims
- 3984US2024375029A1Device for applying magnetic field to a filter for reducing metallic contaminantsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4083US10871713B2Method of controlling reticle masking blade positioning to minimize impact on critical dimension uniformity and device for controlling reticle masking blade positioningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 22, 2020·1 cites·20 claims
- 4182US8513821B2Overlay mark assistant featureYAO HSIN-CHIEH·Filed 2010·Granted Aug 20, 2013·7 cites·20 claims
- 4281US10861790B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·2 cites·20 claims
- 4381US9728407B2Method of forming features with various dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·3 cites·20 claims
- 4480US11150561B2Method and apparatus for collecting information used in image-error compensationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·1 cites·20 claims
- 4580US7517639B2Seal ring arrangements for immersion lithography systemsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 14, 2009·4 cites·34 claims
- 4679US12145087B2Device for applying magnetic field to a filter for reducing metallic contaminantsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 4779US11894238B2Method of fabricating semiconductor device with reduced trench distortionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 4878US11901188B2Method for improved critical dimension uniformity in a semiconductor device fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 4978US10714357B2Methods for improved critical dimension uniformity in a semiconductor device fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·1 cites·20 claims
- 5078US9000525B2Structure and method for alignment marksWEN MING-CHANG·Filed 2010·Granted Apr 7, 2015·5 cites·20 claims
Showing the top 50 of 132 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →