Inventor · disambiguated record
Wakana Fuse
Also filed as: Fuse WAKANA
3 granted patents·2 pending applications·0 citations·filing 2020–2022
40Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0157US12473309B2Organometallic compound and method of manufacturing integrated circuit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 0255US2022324887A1Organometallic adduct compound and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0354US12410203B2Organometallic adduct compound and method of manufacturing integrated circuit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 9, 2025·0 cites·17 claims
- 0452US2021380622A1Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 0551US11466043B2Niobium compound and method of forming thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·17 claims
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