Inventor · disambiguated record
Yao-Ting Tsai
Also filed as: TSAI YAO-TING
21 granted patents·4 pending applications·5 citations·filing 2016–2024
89Inventor score
Top patents by PatentIndex Score
25 records- 0184US11678484B2Semiconductor structure and manufacturing method thereof and flash memoryWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 13, 2023·1 cites·12 claims
- 0275US11424254B2Semiconductor device and manufacturing method of the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Aug 23, 2022·2 cites·6 claims
- 0375US11004805B2Semiconductor device and method of fabricating same including two seal ringsWINBOND ELECTRONICS CORP·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 0472US12471277B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2024·Granted Nov 11, 2025·0 cites·12 claims
- 0570US11877447B2Manufacturing method of semiconductor structure and flash memoryWINBOND ELECTRONICS CORP·Filed 2023·Granted Jan 16, 2024·0 cites·20 claims
- 0666US11839075B2Semiconductor structure and the forming method thereofWINBOND ELECTRONICS CORP·Filed 2022·Granted Dec 5, 2023·0 cites·13 claims
- 0765US11805644B2Manufacturing method of memory deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 31, 2023·0 cites·17 claims
- 0861US11974428B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 30, 2024·0 cites·9 claims
- 0961US11785769B2Manufacturing method of semiconductor device including floating gate and control gateWINBOND ELECTRONICS CORP·Filed 2022·Granted Oct 10, 2023·0 cites·15 claims
- 1061US2025081542A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1160US2025287585A1Manufacturing method of semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1258US2025079315A1Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1356US11257833B2Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 22, 2022·0 cites·6 claims
- 1456US2024304681A1Semiconductor device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1555US10147730B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Dec 4, 2018·0 cites·10 claims
- 1653US11818884B2Method for manufacturing non-volatile memory deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted Nov 14, 2023·0 cites·16 claims
- 1753US9972631B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2016·Granted May 15, 2018·0 cites·6 claims
- 1852US12190981B2Memory array having error checking and correction circuitWINBOND ELECTRONICS CORP·Filed 2022·Granted Jan 7, 2025·0 cites·18 claims
- 1949US11251273B2Non-volatile memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 15, 2022·0 cites·12 claims
- 2047US12040412B2Semiconductor device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jul 16, 2024·0 cites·12 claims
- 2146US10971508B2Integrated circuit and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 2245US11257922B2Self-aligned contact and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 22, 2022·0 cites·13 claims
- 2343US11302705B2Semiconductor structure and the forming method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Apr 12, 2022·0 cites·11 claims
- 2438US10580487B2Three dimensional NOR flash memory with isolated source lines and method of operating the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Mar 3, 2020·0 cites·12 claims
- 2534US10699975B2Semiconductor deviceWINBOND ELECTROICS CORP·Filed 2018·Granted Jun 30, 2020·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →