Inventor · disambiguated record
Gun Lee
Also filed as: LEE GUN · LEE GUN-AH
11 granted patents·6 pending applications·26 citations·filing 2003–2025
84Inventor score
Top patents by PatentIndex Score
17 records- 0183US12154859B2Semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 26, 2024·2 cites·20 claims
- 0276US11121079B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
- 0375US10790255B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·2 cites·17 claims
- 0471US7148080B2Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·19 cites·45 claims
- 0569US10847474B2Semiconductor package and electromagnetic interference shielding structure for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·18 claims
- 0666US2025286006A1Semiconductor package including an encapsulantSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0765US2025054870A1Semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0863US11837537B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 0958US12341118B2Semiconductor package including an encapsulantSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1056US12463104B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 1156US12272666B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·10 claims
- 1256US2025210565A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1355US2024128171A1Method of manufacturing semiconductor package, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1449US2024145326A1Semiconductor package manufacturing method and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1545US10483150B2Apparatus for stacking semiconductor chips in a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 19, 2019·0 cites·19 claims
- 1638US11127692B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·12 claims
- 1734US2019229047A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →