Inventor · disambiguated record
Tsai-Tsung Tsai
Also filed as: TSAI TSAI-TSUNG
19 granted patents·6 pending applications·84 citations·filing 2007–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19CHEN MENG-TSE1HWANG CHIEN LING1LIN CHENG-CHUNG1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
25 records- 0198US9418971B2Package-on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 16, 2016·42 cites·20 claims
- 0295US10032734B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·8 cites·20 claims
- 0390US2025323192A1Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0488US12394736B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 0588US9449908B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 20, 2016·5 cites·20 claims
- 0688US8900922B2Fine-pitch package-on-package structures and methods for forming the sameLIN CHENG-CHUNG·Filed 2012·Granted Dec 2, 2014·11 cites·14 claims
- 0782US11075131B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·3 cites·20 claims
- 0882US9530762B2Semiconductor package, semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 27, 2016·4 cites·30 claims
- 0981US9385040B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·5 cites·20 claims
- 1078US2023378153A1Package-on-Package Structure Including a Thermal Isolation MaterialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1176US11901319B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 1276US10147693B2Methods for stud bump formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 4, 2018·2 cites·20 claims
- 1375US2024404954A1Method of forming packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1470US9021682B2Apparatus for stud bump formationHWANG CHIEN LING·Filed 2012·Granted May 5, 2015·2 cites·19 claims
- 1568US10985122B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 1666US8846448B2Warpage control in a package-on-package structureCHEN MENG-TSE·Filed 2012·Granted Sep 30, 2014·2 cites·13 claims
- 1764US11776945B2Package-on-package structure including a thermal isolation materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 3, 2023·0 cites·20 claims
- 1863US10510697B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 1961US2025316552A1Electronic component and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2060US11056474B2Semiconductor package, semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·20 claims
- 2156US10490539B2Package on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·11 claims
- 2256US10134717B2Semiconductor package, semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·0 cites·20 claims
- 2351US2020020634A1Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
- 2446US2014042622A1Fine Pitch Package-on-Package StructureTSAI TSAI-TSUNG·Filed 2012·Application pending·0 cites
- 2539US7446068B2Composition of dielectric materialWALSIN TECHNOLOGY CORP·Filed 2007·Granted Nov 4, 2008·0 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →