Inventor · disambiguated record
Myung Sam Kang
Also filed as: KANG MYUNG S · KANG MYUNG SAM
104 granted patents·83 pending applications·561 citations·filing 2001–2023
99Inventor score
Files withSAMSUNG ELECTRO MECH146SAMSUNG ELECTRONICS CO LTD18KANG MYUNG-SAM11HWANG MI-SUN4KIM KI HWAN2
Top patents by PatentIndex Score
187 records- 0199US10109588B2Electronic component package and package-on-package structure including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 23, 2018·94 cites·29 claims
- 0298US10727212B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·36 cites·32 claims
- 0396US11676907B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·4 cites·20 claims
- 0495US9899136B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 20, 2018·11 cites·29 claims
- 0594US10614943B2Multilayer seed pattern inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 7, 2020·7 cites·22 claims
- 0694US7277005B2Printed circuit board including embedded resistor and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 2, 2007·34 cites·12 claims
- 0792US10748856B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 18, 2020·8 cites·16 claims
- 0892US7697301B2Printed circuit board having embedded electronic components and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 13, 2010·21 cites·8 claims
- 0990US7707715B2Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 4, 2010·18 cites·21 claims
- 1090US7350296B2Method of fabricating a printed circuit board including an embedded passive componentSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 1, 2008·41 cites·8 claims
- 1189US9832866B2Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·7 cites·7 claims
- 1289US7583512B2Printed circuit board including embedded passive componentSAMSUNG ELECTRO MECH·Filed 2008·Granted Sep 1, 2009·14 cites·6 claims
- 1388US10362667B2Circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 23, 2019·4 cites·4 claims
- 1487US7407596B2Fluxgate sensor integrated in printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 5, 2008·14 cites·19 claims
- 1586US7485569B2Printed circuit board including embedded chips and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Feb 3, 2009·13 cites·10 claims
- 1686US7372261B2Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted May 13, 2008·32 cites·17 claims
- 1785US10811328B1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 20, 2020·4 cites·20 claims
- 1884US10410961B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·4 cites·24 claims
- 1984US10102964B2Coil electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 16, 2018·2 cites·9 claims
- 2082US10636562B2Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 28, 2020·2 cites·20 claims
- 2182US7992291B2Method of manufacturing a circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 9, 2011·9 cites·8 claims
- 2281US7858437B2Method for manufacturing a substrate with cavitySAMSUNG ELECTRO MECH·Filed 2007·Granted Dec 28, 2010·10 cites·2 claims
- 2381US7015691B2Weak-magnetic field sensor using printed circuit board technology and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Mar 21, 2006·26 cites·7 claims
- 2480US11488768B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 1, 2022·1 cites·8 claims
- 2580US10475748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·22 claims
- 2679US9832856B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·3 cites·8 claims
- 2779US7550316B2Board on chip package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 23, 2009·5 cites·6 claims
- 2878US12148708B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 2978US8256112B2Method of manufacturing high density printed circuit boardKANG MYUNG SAM·Filed 2008·Granted Sep 4, 2012·6 cites·6 claims
- 3078US7498205B2Method for manufacturing substrate with cavitySAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 3, 2009·8 cites·6 claims
- 3177US9793250B2Package board, method for manufacturing the same and package on package having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 17, 2017·3 cites·10 claims
- 3277US9655229B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted May 16, 2017·2 cites·18 claims
- 3375US10304628B2Multilayer capacitor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted May 28, 2019·1 cites·16 claims
- 3473US11062999B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 3573US9699885B2Circuit board including heat dissipation structureSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 4, 2017·2 cites·17 claims
- 3673US9420709B2Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 16, 2016·3 cites·20 claims
- 3773US8039762B2Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layerSAMSUNG ELECTRO MECH·Filed 2009·Granted Oct 18, 2011·4 cites·5 claims
- 3872US10650958B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2016·Granted May 12, 2020·1 cites·32 claims
- 3972US7494844B2Method for manufacturing substrate with cavitySAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 24, 2009·5 cites·7 claims
- 4071US10515755B2Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Dec 24, 2019·0 cites·12 claims
- 4171US7937833B2Method of manufacturing circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 10, 2011·4 cites·8 claims
- 4271US7562446B2Method for manufacturing substrate with cavitySAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 21, 2009·5 cites·12 claims
- 4370US11075193B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 27, 2021·1 cites·21 claims
- 4469US2009324992A1Metal clad laminate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 4568US11769622B2Inductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 26, 2023·0 cites·26 claims
- 4668US11605484B2Multilayer seed pattern inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 14, 2023·0 cites·19 claims
- 4768US10541221B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 21, 2020·1 cites·20 claims
- 4868US7516545B2Method of manufacturing printed circuit board having landless via holeSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 14, 2009·3 cites·12 claims
- 4967US10212803B2Circuit board and circuit board assemblySAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 19, 2019·1 cites·23 claims
- 5067US7607222B2Method of manufacturing an electronic component packageSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 27, 2009·3 cites·6 claims
Showing the top 50 of 187 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →