Inventor · disambiguated record

Naomi Kanda

Also filed as: KANDA NAOMI

1 granted patent·3 citations·filing 2004–2004

20Inventor score

Technology areasY10T

Files withMEC CO LTD1

Top patents by PatentIndex Score

1 record

0143US7156904B2Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained therebyMEC CO LTD·Filed 2004·Granted Jan 2, 2007·3 cites·18 claims

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