Inventor · disambiguated record

Ya-Hsi Hwung

Also filed as: HWUNG YA-HSI

2 granted patents·12 citations·filing 2010–2014

57Inventor score

Technology areasH10W

Files withLIN JING-CHENG1 TAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

2 records

0187US8922004B2Copper bump structures having sidewall protection layersLIN JING-CHENG·Filed 2010·Granted Dec 30, 2014·9 cites·20 claims
0276US9093314B2Copper bump structures having sidewall protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·3 cites·20 claims

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