Inventor · disambiguated record

Edmond Soon

Also filed as: SOON EDMOND

1 granted patent·0 citations·filing 2012–2012

8Inventor score

Technology areasH10W

Files withST MICROELECTRONICS PTE LTD1

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1 record

0134US8822267B2System in package manufacturing method using wafer-to-wafer bondingST MICROELECTRONICS PTE LTD·Filed 2012·Granted Sep 2, 2014·0 cites·20 claims

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Edmond Soon — Patent Inventor | PatentIndex