Inventor · disambiguated record

Chang Bu Jeong

Also filed as: JEONG CHANG BU

2 granted patents·6 citations·filing 2020–2020

44Inventor score

Technology areasH10P

Files withSEMES CO LTD2

Top patents by PatentIndex Score

2 records

0191US11600515B2Die pickup module and die bonding apparatus including the sameSEMES CO LTD·Filed 2020·Granted Mar 7, 2023·6 cites·18 claims
0249US12090642B2Die pickup module and die bonding apparatus including the sameSEMES CO LTD·Filed 2020·Granted Sep 17, 2024·0 cites·15 claims

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