Inventor · disambiguated record
Long Hua Lee
Also filed as: LEE LONG HUA
17 granted patents·1 pending application·58 citations·filing 2003–2023
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11TAIWAN SEMICONDUCTOR MFG2CHANG CHUN PLASTICS CO LTD1CHEN CHIH-HAO1LEE LONG HUA1
Top patents by PatentIndex Score
18 records- 0194US11075133B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·7 cites·20 claims
- 0291US8941244B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·12 cites·19 claims
- 0388US9337063B2Package for three dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·8 cites·18 claims
- 0487US11024616B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·5 cites·20 claims
- 0586US11621205B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
- 0684US8963334B2Die-to-die gap control for semiconductor structure and methodLIN JING-CHENG·Filed 2011·Granted Feb 24, 2015·6 cites·20 claims
- 0780US12080617B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0874US12148661B2Method of forming integrated fan-out packages with built-in heat sinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 0974US11842936B2Underfill structure for semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 1074US8772929B2Package for three dimensional integrated circuitCHEN CHIH-HAO·Filed 2011·Granted Jul 8, 2014·3 cites·14 claims
- 1173US10157879B2Die-to-die gap control for semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·2 cites·20 claims
- 1272US10510595B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 1371US6852358B1Process for preparing an optical waveguide component from acrylate/titanium alkoxide composite material and the prepared optical waveguide componentCHANG CHUN PLASTICS CO LTD·Filed 2003·Granted Feb 8, 2005·13 cites·11 claims
- 1461US11257715B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 1551US11201097B2Method of manufacture of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 1648US11121050B2Method of manufacture of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 14, 2021·0 cites·20 claims
- 1747US2009087562A1Method of preparing cross-linked organic glasses for air-gap sacrificial layersLEE LONG HUA·Filed 2008·Application pending·0 cites
- 1843US8629043B2Methods for de-bonding carriersWANG CHUNG YU·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
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